Inventor
Sharon N. Farrens
Inventor
Boise, ID, US
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
H01LSemiconductor devices22%
H10HInorganic light-emitting semiconductor devices having potential barriers15%
H10DInorganic electric semiconductor devices4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
G09GArrangements or circuits for control of indicating devices using static means to present variable information2%
H10KOrganic electric solid-state devices2%
PatentTitleYear
10,714,464Method of selectively transferring LED die to a backplane using height controlled bonding structures202010,693,051Through backplane laser irradiation for die transfer202010,553,571Method of forming an array of a multi-device unit cell202010,236,447Selective die repair on a light emitting device assembly201910,193,038Through backplane laser irradiation for die transfer201910,177,123Light emitting diode array on a backplane and method of making thereof201910,128,142Semiconductor structures including carrier wafers and attached device wafers, and methods of forming such semiconductor structures20189,893,041'Method of forming an array of a multi-device unit cell'20189,716,023'Methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies'20179,472,518'Semiconductor structures including carrier wafers and methods of using such semiconductor structures'20166,908,832'In situ plasma wafer bonding method'20056,645,828'In situ plasma wafer bonding method'20036,534,381'Method for fabricating multi-layered substrates'20036,180,496'In situ plasma wafer bonding method'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2005Patents assigned to SILICON GENESIS CORP (4)· patent assignee history
2001–2005Based in Davis, CA, US· patent location history
2016–2018Patents assigned to MICRON TECHNOLOGY INC (3)· patent assignee history
2016–2020Based in Boise, ID, US· patent location history
2018–2020Patents assigned to GLO AB (7)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GLO AB | 7 | 2018–2020 |
| SILICON GENESIS CORP | 4 | 2001–2005 |
| MICRON TECHNOLOGY INC | 3 | 2016–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Boise, ID, US | 10 | 2016–2020 |
| Davis, California, US | 4 | 2001–2005 |