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Inventor

Shuichi Tanaka

Inventor
Chino, JP

Overview

64→
Patents
1987–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 64 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
B41JTypewriters12%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein6%
G01DMeasuring not specially adapted for a specific variable5%
G01BMeasuring length, thickness or similar linear dimensions3%
H01LSemiconductor devices3%
H05KPrinted circuits3%
H10NElectric solid-state devices not otherwise provided for3%
B23CMilling2%
E04CStructural elements2%
PatentTitleYear
10,808,305High-strength PC steel wire202010,773,517Liquid jet head and method for manufacturing liquid jet head202010,752,974High-strength PC steel wire202010,377,134MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method201910,357,897Concrete-reinforcing shaped body, method of manufacturing the same, structure of packaging concrete-reinforcing shaped body, and method of mixing fiber-reinforced concrete201910,328,697Electronic device201910,323,415Pregrouted PC steel material and curing method for pregrouted layer therein201910,272,686MEMS device, liquid ejecting head, manufacturing method of MEMS device, and manufacturing method of liquid ejecting head201910,259,215Liquid jet head and method for manufacturing liquid jet head201910,245,833Liquid ejecting head and method of manufacturing liquid ejecting head201910,220,619MEMS device, head and liquid jet device20199,956,780Electronic device, liquid ejecting head, and manufacturing method of electronic device20189,941,460Electronic device20189,925,770'Wiring substrate, MEMS device, liquid ejecting head, and liquid ejecting apparatus'20189,902,150'Liquid ejecting head, and manufacturing method of liquid ejecting head'20189,889,655'Liquid ejecting head and method of manufacturing liquid ejecting head'20189,810,550'Position detection device'20179,751,306'Piezoelectric device, liquid ejecting head and method for manufacturing piezoelectric device'20179,708,715'Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus'20179,642,399'Suit and method for manufacturing same'20179,534,954'Optical filter device, optical module, and electronic apparatus'20179,512,960'Rotational support mechanism'20169,450,161'Method of manufacturing a light-emitting device by sintering conductive pastes'20168,508,042'Electronic device and electronic apparatus'20138,421,248'Electronic device and electronic apparatus'20138,407,406'Semiconductor memory device and method of testing the same'20138,207,056'Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device'20128,183,693'Electronic device, method of producing the same, and semiconductor device'20128,183,690'Electronic device'20128,142,602'Method for mounting semiconductor device'20128,114,788'Method for manufacturing semiconductor device'20128,106,509'Electronic device and electronic apparatus'20127,936,073'Semiconductor device and method of manufacturing the same'20117,910,498'Method for manufacturing semiconductor device'20117,888,799'Semiconductor device, circuit substrate, electro-optic device and electronic appliance'20117,830,007'Electronic device, method of producing the same, and semiconductor device'20107,825,518'Semiconductor device and method of manufacturing the same'20107,790,595'Manufacturing method improving the reliability of a bump electrode'20107,741,712'Semiconductor device, circuit substrate, electro-optic device and electronic appliance'20107,714,436'Electronic device and electronic apparatus'20107,671,476'Semiconductor device and method of manufacturing the same'20107,629,671'Semiconductor device having a resin protrusion with a depression and method manufacturing the same'20097,601,626'Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device'20097,576,424'Semiconductor device'20097,524,700'Method for manufacturing semiconductor device, and method and structure for implementing semicondutor device'20097,429,704'Electronic component, electro-optical device, and electronic apparatus'20087,375,427'Semiconductor device, circuit board, electro-optic device, electronic device'20087,348,269'Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus'20087,341,335'Liquid ejection apparatus'20087,276,792'Semiconductor device, circuit substrate, electro-optic device and electronic appliance'20077,246,432'Method of manufacturing semiconductor device'20077,166,920'Electronic component, mounted structure, electro-optical device, and electronic device'20077,143,504'Method of manufacturing a display structure'20067,122,896'Mounting structure of electronic component, electro-optic device, electronic equipment, and method for mounting electronic component'20066,885,310'Phase difference detection device and method for a position detector'20056,779,624'Control unit for power steering apparatus and steering-wheel-angle correcting system'20046,552,666'Phase difference detection device and method for a position detector'20036,133,594'Compound semiconductor device'20006,034,624'Induction-type linear position detector device'20005,969,272'Sample sucking pipe and method for manufacturing same'19995,903,205'Induction-type rotational position detecting device'19995,900,641'Field effect semiconductor device having a reduced leakage current'19995,349,293'Conductive rotational position detection device having stator and rotor'19944,642,686'System for measuring amount of rubber bank between rolls'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987–2004Based in Tokyo, JP· patent location history
1999–2000Patents assigned to FUJITSU LTD (2)· patent assignee history
2000–2003Patents assigned to GOTO ATSUTOSHI (2)· patent assignee history
2000–2005Based in Sagamihara, JP· patent location history
2006–2020Patents assigned to SEIKO EPSON CORP (46)· patent assignee history
2006–2019Based in Chino, JP· patent location history
2007–2019Based in Nagano, JP· patent location history
2012–2013Patents assigned to TANAKA SHUICHI (9)· patent assignee history
2019–2020Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (4)· patent assignee history
2019–2020Based in Suwa, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SEIKO EPSON CORP462006–2020
TANAKA SHUICHIself92012–2013
SUMITOMO ELECTRIC INDUSTRIES42019–2020
FUJITSU LTD21999–2000
GOTO ATSUTOSHI22000–2003
Locations
LocationPatentsSpan
Chino, JP392006–2019
Suwa, JP32019–2020
Nagano, JP32007–2019
Sagamihara, JP32000–2005
Tokyo, JP31987–2004