Inventor

Shohei Tagami

Inventor

Annaka, JP

Overview

2009–2021

Patent span

Chemistry

Primary field (CPC C)

Patents· 30 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds14%

C09JAdhesives14%

H01LSemiconductor devices12%

C08LCompositions of macromolecular compounds10%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%

Y10TTechnical subjects covered by former us classification6%

H05KPrinted circuits4%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%

PatentTitleYear

10,991,611Wafer processing laminate and method for processing wafer2021 10,854,496Circuit substrate processing laminate and method for processing circuit substrate2020 10,242,902Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer2019 10,147,632Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer2018 10,128,143Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer2018 10,115,622Wafer processing laminate and method for processing wafer2018 10,106,713Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer2018 9,934,996Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method2018 9,887,118'Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer'2018 9,653,335'Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method'2017 9,646,868'Wafer temporary bonding method and thin wafer manufacturing method'2017 9,472,438'Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer'2016 9,458,365'Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same'2016 9,365,681'Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method'2016 9,334,424'Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer'2016 9,263,333'Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer'2016 9,096,032'Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method'2015 9,063,421'Chemically amplified positive resist composition and pattern forming process'2015 8,999,817'Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer'2015 8,785,585'Temporary adhesive composition, and method of producing thin wafer'2014 8,748,293'Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same'2014 8,735,264'Temporary adhesive composition and method for manufacturing thin wafer using the same'2014 8,715,905'Silphenylene-containing photocurable composition, pattern formation method using same, and optical semiconductor element obtained using the method'2014 8,673,537'Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition'2014 8,487,062'Polyimidesilicone having alcoholic hydroxyl group and process for producing the same'2013 8,263,308'Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation'2012 8,252,882'Polyimide resin produced by using silphenylene compound'2012 8,048,978'Silphenylene compound and process for producing the same'2011 7,781,541'Polyimide silicone resin and thermosetting composition comprising the same'2010 7,638,259'Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2021Patents assigned to SHINETSU CHEMICAL CO (30)· patent assignee history

2009–2021Based in Annaka, JP· patent location history

2012–2017Patents assigned to TAGAMI SHOHEI (7)· patent assignee history

2012–2017Patents assigned to KATO HIDETO (6)· patent assignee history

2012–2017Patents assigned to SUGO MICHIHIRO (6)· patent assignee history

2014Patents assigned to FURUYA MASAHIRO (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SHINETSU CHEMICAL CO	30	2009–2021
TAGAMI SHOHEIself	7	2012–2017
KATO HIDETO	6	2012–2017
SUGO MICHIHIRO	6	2012–2017
FURUYA MASAHIRO	3	2014

Locations

Location	Patents	Span
Annaka, JP	30	2009–2021