Inventor

Seong Min Seo

Inventor

Seoul, KR

Overview

1998–2019

Patent span

Electricity

Primary field (CPC H)

Patents· 29 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%

H01LSemiconductor devices22%

G06FElectric digital data processing6%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%

A47CChairs3%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution3%

Y02PClimate change mitigation technologies in the production or processing of goods3%

Y10TTechnical subjects covered by former us classification3%

G06KGraphical data reading2%

G06VImage or video recognition or understanding2%

PatentTitleYear

10,515,825Semiconductor device and manufacturing method thereof2019 10,388,643Semiconductor device using EMC wafer support system and fabricating method thereof2019 10,297,466Semiconductor device and manufacturing method thereof2019 10,079,157Semiconductor device and manufacturing method thereof2018 9,966,276Semiconductor device and manufacturing method thereof2018 9,946,372Pen type input device and method for character input and mouse functions2018 9,747,959'Stacked memory devices, and memory packages and memory systems having the same'2017 9,627,368'Semiconductor device using EMC wafer support system and fabricating method thereof'2017 9,536,858'Semiconductor device and manufacturing method thereof'2017 9,502,375'Semiconductor device with plated pillars and leads'2016 9,478,517'Electronic device package structure and method of fabricating the same'2016 9,454,246'Multi-functional pen and method for using multi-functional pen'2016 9,449,946'Semiconductor device and manufacturing method thereof'2016 9,423,910'Display device having pattern and method of detecting pixel position therein'2016 9,196,601'Semiconductor device'2015 9,104,937'Apparatus and method for recognizing image with increased image recognition rate'2015 9,048,241'Semiconductor device utilzing redistribution layers to couple stacked die'2015 9,000,586'Semiconductor device and manufacturing method thereof'2015 8,055,299'Mobile input device of mobile terminal'2011 7,446,422'Wafer level chip scale package and manufacturing method for the same'2008 7,362,038'Surface acoustic wave (SAW) device package and method for packaging a SAW device'2008 7,359,579'Image sensor package and its manufacturing method'2008 6,987,319'Wafer-level chip-scale package'2006 6,953,988'Semiconductor package'2005 6,858,919'Semiconductor package'2005 6,841,874'Wafer-level chip-scale package'2005 6,759,737'Semiconductor package including stacked chips with aligned input/output pads'2004 5,858,149'Process for bonding semiconductor chip'1999 5,740,956'Bonding method for semiconductor chips'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2019Based in Seoul, KR· patent location history

1999–2019Patents assigned to AMKOR TECHNOLOGY INC (22)· patent assignee history

2011–2018Patents assigned to SAMSUNG ELECTRONICS CO LTD (6)· patent assignee history

2011Based in Yongin-si, KR· patent location history

2015–2018Patents assigned to SEO SEONG MIN (3)· patent assignee history

2015Patents assigned to DO WON CHUL (2)· patent assignee history

2015Patents assigned to PAEK JONG SIK (2)· patent assignee history

2015–2016Based in Gyeonggi-do, KR· patent location history

2016–2018Based in Hwaseong-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
AMKOR TECHNOLOGY INC	22	1999–2019
SAMSUNG ELECTRONICS CO LTD	6	2011–2018
SEO SEONG MINself	3	2015–2018
DO WON CHUL	2	2015
PAEK JONG SIK	2	2015

Locations

Location	Patents	Span
Seoul, KR	24	1998–2019
Hwaseong-si, KR	2	2016–2018
Gyeonggi-do, KR	2	2015–2016
Yongin-si, KR	1	2011