Inventor
Robert L. Borwick, III
Inventor
Thousand Oaks, CA, US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G04Fprimary
G04FTime-interval measuring10%
Y10TTechnical subjects covered by former us classification10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
G01NInvestigating or analysing materials by determining their chemical or physical properties6%
G02BOptical elements, systems or apparatus6%
H01FMagnets6%
B81BMicrostructural devices or systems, e.g. micromechanical devices4%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems4%
H01GCapacitors4%
H10DInorganic electric semiconductor devices4%
PatentTitleYear
10,416,246Physics package for compact atomic device201910,325,707Integrated field coil for compact atomic devices20199,607,748'Micro-fabricated integrated coil and magnetic circuit and method of manufacturing thereof'20178,995,800'Method of fabricating silicon waveguides with embedded active circuitry'20158,937,513'Micro-scale system to provide thermal isolation and electrical communication between substrates'20158,826,514'Microfabricated inductors with through-wafer vias'20148,654,332'Chip-scale optics module for optical interrogators'20148,614,610'Ruggedized waveguide encapsulation fixture for receiving a compressed waveguide component'20138,456,249'Micro-scale system to provide thermal isolation and electrical communication between substrates'20138,319,156'System for heating a vapor cell'20128,258,884'System for charging a vapor cell'20128,187,972'Through-substrate vias with polymer fill and method of fabricating same'20128,088,667'Method of fabricating vertical capacitors in through-substrate vias'20128,080,736'Non-planar microcircuit structure and method of fabricating same'20117,810,379'High temperature microelectromechanical (MEM) devices'20107,735,362'Thermomechanical sensor for fluid diagnostics'20107,619,485'Compact optical assembly for chip-scale atomic clock'20097,538,032'Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said method'20097,346,981'Method for fabricating microelectromechanical system (MEMS) devices'20087,328,604'Microelectromechanical (MEM) fluid health sensing device and fabrication method'20087,329,932'Microelectromechanical (MEM) viscosity sensor and method'20087,303,935'High temperature microelectromechanical (MEM) devices and fabrication method'20077,287,415'Microelectromechanical system (MEMS) viscosity sensor for fluid health monitoring'20077,261,430'Thermal and intrinsic stress compensated micromirror apparatus and method'20076,979,872'Modules integrating MEMS devices with pre-processed electronic circuitry, and methods for fabricating such modules'20056,771,081'Liquid-medium immersed MEMs devices'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2019Based in Thousand Oaks, CA, US· patent location history
2007–2010Patents assigned to TELEDYNE LICENSING LLC (7)· patent assignee history
2009–2019Patents assigned to TELEDYNE SCIENT & IMAGING LLC (16)· patent assignee history
2011–2015Patents assigned to DENATALE JEFFREY F (9)· patent assignee history
2011–2015Patents assigned to STUPAR PHILIP A (8)· patent assignee history
2011–2015Patents assigned to BORWICK III ROBERT L (7)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TELEDYNE SCIENT & IMAGING LLC | 16 | 2009–2019 |
| DENATALE JEFFREY F | 9 | 2011–2015 |
| STUPAR PHILIP A | 8 | 2011–2015 |
| BORWICK III ROBERT Lself | 7 | 2011–2015 |
| TELEDYNE LICENSING LLC | 7 | 2007–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Thousand Oaks, California, US | 26 | 2004–2019 |