Inventor
Michael Schreyer
Inventor
Weisendorf, DE
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds36%
C08LCompositions of macromolecular compounds21%
B29CShaping or joining of plastics14%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients7%
H01BCables7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
6,225,377'Blending epoxy resin-polyisocyanate-filler mixture and phenolic resin-filler mixture for molding'20016,201,074'Mixture of epoxy resin, epoxide group-containing P compound, P-modified epoxy resin and polyamine'20015,919,843'Epoxy resin moulding compounds having halogen-free flame retardation'19995,527,874'Oxazolidinone structures-containing prepolymeric epoxy mixture'19965,496,892'Oxazolidinone structures-containing prepolymeric epoxy resin mixture'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2001Patents assigned to SIEMENS AG (5)· patent assignee history
1996–2001Based in Weisendorf, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SIEMENS AG | 5 | 1996–2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Weisendorf, DE | 5 | 1996–2001 |