Inventor
Eiichi Asano
Inventor
Gunma, JP
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
C08LCompositions of macromolecular compounds19%
Y10TTechnical subjects covered by former us classification18%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds15%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds2%
C09CTreatment of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties2%
C03CChemical composition of glasses, glazes or vitreous enamels1%
C09KMaterials for miscellaneous applications, not provided for elsewhere1%
PatentTitleYear
8,048,969'Semiconductor encapsulating epoxy resin composition and semiconductor device'20117,943,706'Semiconductor encapsulating epoxy resin composition and semiconductor device'20117,432,603'Semiconductor encapsulating epoxy resin composition and semiconductor device'20087,095,125'Semiconductor encapsulating epoxy resin composition and semiconductor device'20066,894,091'Semiconductor encapsulating epoxy resin composition and semiconductor device'20056,794,058'Flip-chip type semiconductor device'20046,723,452'Semiconductor encapsulating epoxy resin composition and semiconductor device'20046,630,745'Semiconductor encapsulating epoxy resin composition and semiconductor device'20036,627,328'Light-transmissive epoxy resin composition and semiconductor device'20036,518,332'Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith'20036,297,306'Semiconductor encapsulating epoxy resin composition and semiconductor device'20016,291,556'Semiconductor encapsulating epoxy resin composition and semiconductor device'20016,274,251'Semiconductor encapsulating epoxy resin composition and semiconductor device'20016,207,296'Inorganic filler, epoxy resin composition, and semiconductor device'20016,177,489'Semiconductor encapsulating epoxy resin composition and semiconductor device'20016,168,872'Semiconductor encapsulating epoxy resin composition and semiconductor device'20016,162,878'Semiconductor encapsulating epoxy resin composition and semiconductor device'20006,027,812'Encapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction product'20006,001,901'Epoxy resin composition'19995,990,022'Method of evaluating a silicon wafer'19995,940,688'Epoxy resin composition and semiconductor device encapsulated therewith'19995,935,314'Inorganic filler, epoxy resin composition, and semiconductor device'19995,904,568'Method of manufacturing a semiconductor wafer'19995,897,327'Method of evaluating a semiconductor wafer'19995,739,187'Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith'19985,175,199'High transparency silica-titania glass beads, method for making, and light transmission epoxy resin compositions'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2011Patents assigned to SHINETSU CHEMICAL CO (20)· patent assignee history
1992Based in Niigata, JP· patent location history
1998Patents assigned to CIBA GEIGY CORP (1)· patent assignee history
1998–2006Based in Usui-gun, JP· patent location history
1999Patents assigned to KOMATSU DENSHI KINZOKU KK (3)· patent assignee history
1999–2001Patents assigned to MITSUBISHI ELECTRIC CORP (2)· patent assignee history
1999–2011Based in Gunma, JP· patent location history
1999Based in Kanagawa, JP· patent location history
2001Patents assigned to HOKKO CHEM IND CO (2)· patent assignee history
2011Based in Annaka, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINETSU CHEMICAL CO | 20 | 1992–2011 |
| KOMATSU DENSHI KINZOKU KK | 3 | 1999 |
| HOKKO CHEM IND CO | 2 | 2001 |
| MITSUBISHI ELECTRIC CORP | 2 | 1999–2001 |
| CIBA GEIGY CORP | 1 | 1998 |
Locations
| Location | Patents | Span |
|---|---|---|
| Gunma, JP | 14 | 1999–2011 |
| Usui-gun, JP | 7 | 1998–2006 |
| Kanagawa, JP | 3 | 1999 |
| Annaka, JP | 1 | 2011 |
| Niigata, JP | 1 | 1992 |