Inventor
Hiroki Terazaki
Inventor
Tsukuba, JP
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C09Gprimary
C09GPolishing compositions27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
C09KMaterials for miscellaneous applications, not provided for elsewhere21%
C23FNon-mechanical removal of metallic material from surface12%
C01FCompounds of the metals beryllium, magnesium, aluminium, calcium, strontium, barium, radium, thorium, or of the rare-earth metals5%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds5%
H01LSemiconductor devices1%
PatentTitleYear
8,900,477'Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same'20148,616,936'Abrasive, method of polishing target member and process for producing semiconductor device'20138,491,807'Abrasive liquid for metal and method for polishing'20138,226,849'Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same'20128,162,725'Abrasive, method of polishing target member and process for producing semiconductor device'20128,137,159'Abrasive, method of polishing target member and process for producing semiconductor device'20128,038,898'Abrasive liquid for metal and method for polishing'20117,963,825'Abrasive, method of polishing target member and process for producing semiconductor device'20117,871,308'Abrasive, method of polishing target member and process for producing semiconductor device'20117,867,303'Cerium oxide abrasive and method of polishing substrates'20117,799,686'Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same'20107,799,688'Polishing fluid and method of polishing'20107,708,788'Cerium oxide abrasive and method of polishing substrates'20107,250,369'Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same'20077,115,021'Abrasive, method of polishing target member and process for producing semiconductor device'20066,899,821'Abrasive liquid for metal and method for polishing'20056,896,825'Abrasive liquid for metal and method for polishing'20056,863,700'Cerium oxide abrasive and method of polishing substrates'20056,343,976'Abrasive, method of polishing wafer, and method of producing semiconductor device'20026,221,118'Cerium oxide abrasive and method of polishing substrates'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2014Patents assigned to HITACHI CHEMICAL CO LTD (18)· patent assignee history
2001–2014Based in Tsukuba, JP· patent location history
2002–2013Based in Ibaraki, JP· patent location history
2005–2014Patents assigned to HITACHI LTD (7)· patent assignee history
2010Based in Hitachi, JP· patent location history
2012–2014Patents assigned to TERAZAKI HIROKI (6)· patent assignee history
2012–2013Patents assigned to MATSUZAWA JUN (4)· patent assignee history
2012–2013Patents assigned to ASHIZAWA TORANOSUKE (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI CHEMICAL CO LTD | 18 | 2001–2014 |
| HITACHI LTD | 7 | 2005–2014 |
| TERAZAKI HIROKIself | 6 | 2012–2014 |
| MATSUZAWA JUN | 4 | 2012–2013 |
| ASHIZAWA TORANOSUKE | 3 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tsukuba, JP | 11 | 2001–2014 |
| Ibaraki, JP | 8 | 2002–2013 |
| Hitachi, JP | 1 | 2010 |