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Inventor

Nakano Liu

Inventor
Beijing, CN

Overview

2→
Patents
2014–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C23Cprimary
C23CCoating metallic material14%
G06FElectric digital data processing14%
G10LSpeech analysis techniques or speech synthesis14%
H01LSemiconductor devices14%
H04MTelephonic communication14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
PatentTitleYear
10,897,534Optimization for a call that waits in queue20218,911,551'Electroless plating apparatus and method'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014Patents assigned to CHEN JASON (1)· patent assignee history
2014Patents assigned to CHU WEN (1)· patent assignee history
2014Patents assigned to HUA CHANG-HWANG (1)· patent assignee history
2014Patents assigned to LIU NAKANO (1)· patent assignee history
2014Based in Tao Yuan Shien, TW· patent location history
2021Patents assigned to IBM (1)· patent assignee history
2021Based in Beijing, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHEN JASON12014
CHU WEN12014
HUA CHANG-HWANG12014
IBM12021
LIU NAKANOself12014
Locations
LocationPatentsSpan
Beijing, CN12021
Tao Yuan Shien, TW12014