Inventor

Kenji Kobae

Inventor

Kawasaki, JP

Overview

43→

Patents

1999–2013

Patent span

Electricity

Primary field (CPC H)

Patents· 43 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%

Y10TTechnical subjects covered by former us classification14%

G06KGraphical data reading10%

G11BInformation storage based on relative movement between record carrier and transducer6%

H05KPrinted circuits6%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%

B23KSoldering or unsoldering5%

H10DInorganic electric semiconductor devices4%

B29CShaping or joining of plastics2%

B05CApparatus for applying fluent materials to surfaces, in general1%

PatentTitleYear

8,517,277'Radio frequency identification tag and method of manufacturing the same'2013 8,395,904'Multichip module, printed circuit board unit, and electronic apparatus'2013 8,381,963'Compression-bonding apparatus'2013 8,308,071'RFID tag and manufacturing method thereof'2012 8,299,925'RFID tag and manufacturing method thereof'2012 8,169,075'Electronic part with affixed MEMS'2012 8,081,081'Electronic apparatus and method of manufacturing the same'2011 8,076,233'Method of forming electrode connecting portion'2011 8,062,926'Manufacturing method for RFID tag'2011 7,982,295'Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device'2011 7,960,215'Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device'2011 7,902,983'RFID tag'2011 7,789,316'Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device'2010 7,712,650'Method of mounting a semiconductor chip'2010 7,687,314'Electronic apparatus manufacturing method'2010 7,670,873'Method of flip-chip mounting'2010 7,582,553'Method of bonding flying leads'2009 7,566,586'Method of manufacturing a semiconductor device'2009 7,514,788'Structure of mounting electronic component'2009 7,507,654'Method for mounting electronic element on a circuit board'2009 7,471,081'Slider tester'2008 7,424,966'Method of ultrasonic mounting and ultrasonic mounting apparatus using the same'2008 7,416,921'Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin'2008 7,394,163'Method of mounting semiconductor chip'2008 7,385,788'Carriage assembly of a hard disk drive'2008 7,367,108'Method of bonding flying leads'2008 7,356,907'Method of manufacturing a carriage assembly of a hard disk drive'2008 7,355,285'Structure of mounting electronic component'2008 7,350,685'Method of mounting electronic component'2008 7,347,347'Head assembly, disk unit, and bonding method and apparatus'2008 7,208,059'Method of ultrasonic-mounting electronic component and ultrasonic mounting machine'2007 7,196,512'Magnetic head tester'2007 7,134,588'Bonding tool for ultrasonic bonding and method of ultrasonic bonding'2006 6,885,522'Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation'2005 6,787,925'Mounting method of semiconductor device'2004 6,770,319'Resin coating method'2004 6,716,665'Method of mounting chip onto printed circuit board in shortened working time'2004 6,582,993'Method of underfilling semiconductor device'2003 6,458,237'Mounting method of semiconductor device'2002 6,437,450'Method of mounting semiconductor chip'2002 6,240,634'Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board'2001 6,122,823'Apparatus to produce a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board'2000 6,006,426'Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2013Patents assigned to FUJITSU LTD (43)· patent assignee history

1999–2013Based in Kawasaki, JP· patent location history

2011–2013Patents assigned to KOBAE KENJI (9)· patent assignee history

2011–2012Patents assigned to KOBAYASHI HIROSHI (3)· patent assignee history

2012–2013Patents assigned to MATSUMURA TAKAYOSHI (3)· patent assignee history

2012–2013Patents assigned to TAKAHASHI TETSUYA (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
FUJITSU LTD	43	1999–2013
KOBAE KENJIself	9	2011–2013
KOBAYASHI HIROSHI	3	2011–2012
MATSUMURA TAKAYOSHI	3	2012–2013
TAKAHASHI TETSUYA	3	2012–2013

Locations

Location	Patents	Span
Kawasaki, JP	43	1999–2013