LexDanaLexDanabeta
Inventor

Corey Jacobsen

Inventor
Boise, ID, US

Overview

3→
Patents
2007–2010
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B33Yprimary
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
7,663,224'Semiconductor BGA package having a segmented voltage plane'20107,501,313'Method of making semiconductor BGA package having a segmented voltage plane'20097,233,064'Semiconductor BGA package having a segmented voltage plane and method of making'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2010Patents assigned to MICRON TECHNOLOGY INC (3)· patent assignee history
2007–2010Based in Boise, ID, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC32007–2010
Locations
LocationPatentsSpan
Boise, ID, US32007–2010