Inventor
Scott E. Moore
Inventor
Meridian, ID, US
Overview
Patents· 160 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing36%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool5%
B24DTools for grinding, buffing or sharpening5%
C25FProcesses for the electrolytic removal of materials from objects4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
Y10TTechnical subjects covered by former us classification3%
G06KGraphical data reading2%
G08BSignalling systems, e.g. personal calling systems2%
B25BTools or bench devices not otherwise provided for, for fastening, connecting, disengaging, or holding2%
PatentTitleYear
11,025,658Generating summaries of messages associated with assets in an enterprise system202110,492,886Ink for marking a tissue specimen201910,079,810Decryption and analysis of network traffic using key material collected from endpoint devices of a computer network20189,835,446Non-contact deviation measurement system20179,733,052'Manufacturing process to produce metalurgically programmed terminal performance projectiles'20179,700,186'Portable vacuuming device for collecting and neutralizing flammable residue'20179,360,284'Manufacturing process to produce metalurgically programmed terminal performance projectiles'20169,329,009'Manufacturing process to produce programmed terminal performance projectiles'20169,134,164'Non-contact deviation measurement system'20158,378,789'RFID material tracking method and apparatus'20138,269,605'RFID material tracking method and apparatus'20128,209,874'Building frame construction tools and methods using laser alignment'20128,125,316'RFID material tracking method and apparatus'20128,048,287'Method for selectively removing conductive material from a microelectronic substrate'20118,007,275'Methods and apparatuses for heating semiconductor wafers'20117,983,873'Non-contact deviation measurement system'20117,972,485'Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate'20117,808,367'RFID material tracking method and apparatus'20107,625,495'Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies'20097,618,528'Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate'20097,604,729'Methods and apparatus for selectively removing conductive material from a microelectronic substrate'20097,588,677'Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate'20097,568,579'High stability package for dental treatment devices'20097,560,017'Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium'20097,538,880'Turbidity monitoring methods, apparatuses, and sensors'20097,530,877'Semiconductor processor systems, a system configured to provide a semiconductor workpiece process fluid'20097,524,410'Methods and apparatus for removing conductive material from a microelectronic substrate'20097,438,632'Method and apparatus for cleaning a web-based chemical mechanical planarization system'20087,383,152'Non-contact deviation measurement system'20087,294,040'Method and apparatus for supporting a microelectronic substrate relative to a planarization pad'20077,278,905'Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation'20077,273,411'Polishing apparatus'20077,261,832'Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies'20077,229,336'Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization'20077,220,166'Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate'20077,180,591'Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece processing methods, and turbidity monitoring methods'20077,172,491'Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization'20077,160,176'Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate'20077,153,195'Methods and apparatus for selectively removing conductive material from a microelectronic substrate'20067,153,410'Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces'20067,144,304'Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface'20067,134,934'Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium'20067,118,455'Semiconductor workpiece processing methods'20067,118,447'Semiconductor workpiece processing methods'20067,118,445'Semiconductor workpiece processing methods, a method of preparing semiconductor workpiece process fluid, and a method of delivering semiconductor workpiece process fluid to a semiconductor processor'20067,112,121'Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate'20067,112,122'Methods and apparatus for removing conductive material from a microelectronic substrate'20067,094,131'Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material'20067,074,113'Methods and apparatus for removing conductive material from a microelectronic substrate'20067,070,659'System for filling openings in semiconductor products'20067,063,603'Method and apparatus for cleaning a web-based chemical mechanical planarization system'20067,063,595'Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface'20067,060,608'System and method for filling openings in semiconductor products'20067,053,775'RFID material tracking method and apparatus'20067,042,358'RFID material tracking method and apparatus'20067,001,251'Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine'20067,001,845'Methods of treating surfaces of substrates'20066,997,789'Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface'20066,969,297'Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization'20056,956,538'RFID material tracking method and apparatus'20056,949,011'Method and apparatus for cleaning a web-based chemical mechanical planarization system'20056,945,855'Method and apparatus for cleaning a web-based chemical mechanical planarization system'20056,922,253'Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates'20056,921,318'Semiconductor die de-processing using a die holder and chemical mechanical polishing'20056,913,519'Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates'20056,858,538'Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies'20056,840,840'Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization'20056,830,666'Electroplating apparatus and method'20046,827,630'Method and apparatus for wireless transfer of chemical-mechanical planarization measurements'20046,817,928'Method and apparatus for planarizing and cleaning microelectronic substrates'20046,793,558'Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface'20046,786,805'Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface'20046,786,799'Method and apparatus for wireless transfer of chemical-mechanical planarization measurements'20046,780,095'Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates'20046,780,082'Method and apparatus for wireless transfer of chemical-mechanical planarization measurements'20046,773,332'Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization'20046,755,718'Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization'20046,749,489'Method and apparatus for planarizing and cleaning microelectronic substrates'20046,739,952'Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface'20046,736,698'Method and apparatus for wireless transfer of chemical-mechanical planarization measurements'20046,734,121'Methods of treating surfaces of substrates'20046,733,363'Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization'20046,722,957'Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface'20046,720,266'Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies'20046,714,121'RFID material tracking method and apparatus'20046,706,139'Method and apparatus for cleaning a web-based chemical mechanical planarization system'20046,702,647'Method and apparatus for wireless transfer of chemical-mechanical planarization measurements'20046,699,791'Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies'20046,672,949'Polishing apparatus'20046,663,470'Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine'20036,652,370'Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates'20036,642,140'System for filling openings in semiconductor products'20036,626,734'Method and apparatus for wireless transfer of chemical-mechanical planarization measurements'20036,623,329'Method and apparatus for supporting a microelectronic substrate relative to a planarization pad'20036,612,900'Method and apparatus for wireless transfer of chemical-mechanical planarization measurements'20036,612,328'In-line valve'20036,613,105'System for filling openings in semiconductor products'20036,609,947'Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates'20036,602,380'Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine'20036,585,575'Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine'20036,572,440'Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization'20036,559,054'Methods of treating surfaces of substrates'20036,547,639'Method and apparatus for wireless transfer of chemical-mechanical planarization measurements'20036,544,109'Slurry delivery and planarization systems'20036,540,588'Method and apparatus for wireless transfer of chemical-mechanical planarization measurements'20036,537,915'Methods of treating surfaces of substrates'20036,537,190'Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates'20036,531,401'Method of cleaning a substrate surface using a frozen material'20036,514,125'Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine'20036,514,130'Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates'20036,506,101'Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine'20036,492,273'Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies'20026,482,077'Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine'20026,472,325'Method and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies'20026,468,912'Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies'20026,461,964'Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies'20026,453,932'In-line valve'20026,447,369'Planarizing machines and alignment systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates'20026,428,404'Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies'20026,425,802'Apparatus for supplying flush fluid'20026,419,560'Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies'20026,419,572'Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates'20026,416,402'Methods of polishing microelectronic substrates, and methods of polishing wafers'20026,402,601'Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies'20026,394,883'Method and apparatus for planarizing and cleaning microelectronic substrates'20026,390,910'Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates'20026,368,193'Method and apparatus for planarizing and cleaning microelectronic substrates'20026,364,746'Endpoint detection apparatus, planarizing machines with endpointing apparatus, and endpointing methods for mechanical or chemical-mechanical planarization of microelectronic-substrate assemblies'20026,364,757'Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates'20026,361,411'Method for conditioning polishing surface'20026,358,127'Method and apparatus for planarizing and cleaning microelectronic substrates'20026,354,930'Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates'20026,352,466'Method and apparatus for wireless transfer of chemical-mechanical planarization measurements'20026,344,126'Electroplating apparatus and method'20026,312,558'Method and apparatus for planarization of a substrate'20016,306,008'Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization'20016,306,014'Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies'20016,290,576'Semiconductor processors, sensors, and semiconductor processing systems'20016,273,796'Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface'20016,261,163'Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies'20016,248,001'Semiconductor die de-processing using a die holder and chemical mechanical polishing'20016,234,878'Endpoint detection apparatus, planarizing machines with endpointing apparatus, and endpointing methods for mechanical or chemical-mechanical planarization of microelectronic substrate assemblies'20016,217,727'Electroplating apparatus and method'20016,213,144'In-line valve'20016,206,754'Endpoint detection apparatus, planarizing machines with endpointing apparatus, and endpointing methods for mechanical or chemical-mechanical planarization of microelectronic substrate assemblies'20016,196,899'Polishing apparatus'20016,193,588'Method and apparatus for planarizing and cleaning microelectronic substrates'20016,187,681'Method and apparatus for planarization of a substrate'20016,152,808'Microelectronic substrate polishing systems, semiconductor wafer polishing systems, methods of polishing microelectronic substrates, and methods of polishing wafers'20006,146,246'Method for supplying flush fluid'20006,139,402'Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates'20006,102,782'System and apparatus for distributing flush fluid to processing equipment'20005,954,912'Rotary coupling'19995,833,519'Method and apparatus for mechanical polishing'19985,747,386'Rotary coupling'19985,261,776'Vacuum operated wafer transfer apparatus'19935,100,287'Method of transferring wafers using vacuum'19924,915,597'Filter pump head assembly improvements'19904,881,487'Fluid level sensing method and apparatus'19894,872,356'Resistivity probe fixture'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–2011Patents assigned to MICRON TECHNOLOGY INC (140)· patent assignee history
1989–1993Based in Boise, ID, US· patent location history
1998–2013Based in Meridian, ID, US· patent location history
2008–2017Patents assigned to ALLIANT TECHSYSTEMS INC (4)· patent assignee history
2008–2017Based in Elk River, MN, US· patent location history
2009–2011Based in Nampa, ID, US· patent location history
2010–2013Patents assigned to ROUND ROCK RES LLC (6)· patent assignee history
2012–2015Patents assigned to MOORE SCOTT E (5)· patent assignee history
2015–2017Patents assigned to VISTA OUTDOOR OPERATIONS LLC (6)· patent assignee history
2018–2021Based in Fredericksburg, VA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 140 | 1989–2011 |
| ROUND ROCK RES LLC | 6 | 2010–2013 |
| VISTA OUTDOOR OPERATIONS LLC | 6 | 2015–2017 |
| MOORE SCOTT Eself | 5 | 2012–2015 |
| ALLIANT TECHSYSTEMS INC | 4 | 2008–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Meridian, ID, US | 139 | 1998–2013 |
| Elk River, Minnesota, US | 8 | 2008–2017 |
| Boise, ID, US | 5 | 1989–1993 |
| Nampa, ID, US | 4 | 2009–2011 |
| Fredericksburg, Virginia, US | 2 | 2018–2021 |