Inventor
Joseph D. Dutson
Inventor
Loveland, CO, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
Y10TTechnical subjects covered by former us classification20%
H01RElectrically-conductive connections10%
Y02PClimate change mitigation technologies in the production or processing of goods10%
PatentTitleYear
7,434,309'Method and apparatus for supporting a circuit component having solder column interconnects using an external support'20087,273,386'Pin shroud'20076,882,536'Wrap-around cooling arrangement for printed circuit board'20056,791,184'Support assembly for an integrated circuit package having solder columns'20046,710,264'Method and apparatus for supporting a circuit component having solder column interconnects using external support'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2008Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (5)· patent assignee history
2004–2008Based in Loveland, CO, US· patent location history
2007Based in Hyde Park, UT, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HEWLETT PACKARD DEVELOPMENT CO | 5 | 2004–2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| Loveland, CO, US | 4 | 2004–2008 |
| Hyde Park, UT, US | 1 | 2007 |