Inventor
Ercan Mehmet Dede
Inventor
Ann Arbor, MI, US
Overview
Patents· 137 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
H01LSemiconductor devices12%
H05KPrinted circuits10%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application5%
Y02TClimate change mitigation technologies related to transportation4%
B60LPropulsion of electrically-propelled vehicles3%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution3%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact2%
G06FElectric digital data processing2%
B60KArrangement or mounting of propulsion units or of transmissions in vehicles2%
PatentTitleYear
11,125,248Fan performance tuning202111,101,193Power electronics modules including integrated jet cooling202111,081,422Self-healing PDMS encapsulation and repair of power modules202111,067,343Thermal compensation layers with core-shell phase change particles and power electronics assemblies incorporating the same202111,024,921Component insulation systems202111,009,853Method of tool path generation for additive manufacturing with vector distribution202110,996,541Nonlinear optics enabled transparent display202110,996,000Absorption-based system for automotive waste heat recovery202110,964,469Cooling magnetic cores with ferrofluid and magnetic cores so cooled202110,965,172Shape adaptive wireless charging coil for vehicle interior202110,945,354Cooling systems comprising fluid diodes with variable diodicity for two-phase flow control202110,926,273Systems and methods for modifying an infrared signature of a vehicle202110,901,161Optical power transfer devices with an embedded active cooling chip202110,903,537Optimized heat conducting member for battery cell thermal management202110,896,865Power electronics modules including an integrated cooling channel extending through an electrically-conductive substrate202110,892,632Configurable grid charging coil with active switch and sensing system202110,850,634Multi-turn configurable grid charging coil202010,811,187Methods of fabricating thermal composites having specifically designed particle distributions202010,804,818Triboelectric generator and network for mechanical energy harvesting202010,791,649Manifold structures having an integrated fluid channel system and assemblies comprising the same202010,784,115Method of etching microelectronic mechanical system features in a silicon wafer202010,761,344Systems and methods for generating a volumetric image and interacting with the volumetric image using a planar display202010,751,840Multilayer composite bonding materials and power electronics assemblies incorporating the same202010,746,477Systems and methods for degassing and charging phase-change thermal devices202010,696,239Use of a lenticular lens array to apply a display inside of a vehicle202010,700,571Cooling system for vehicle motor drive202010,692,302Servicing schedule method based on prediction of degradation in electrified vehicles202010,686,085Power electronics assemblies having opticondistors and an embedded active cooling chip202010,685,905Multi-layer cooling structure including through-silicon vias through a plurality of directly-bonded substrates and methods of making the same202010,679,530Systems and methods for mobile projection in foggy conditions202010,668,828Multi-coil charging system for distributed in-wheel motors202010,627,653Thermal guiding for photonic components202010,587,208Triboelectric generator housing and system for vehicle wheel202010,579,069Autonomous driving systems using aerial vehicles202010,574,152Use of additional resistances and capacitances by optimization to solve gate voltage oscillation during short circuit turn-off protection for a semiconductor switch202010,562,469Cooling assemblies for cooling heat generating components and vehicles and electronics assemblies incorporating the same202010,566,265Electronic assemblies having a cooling chip layer with impingement channels and through substrate vias202010,556,481Systems and methods for providing heating and cooling to a vehicle cabin of autonomous vehicles202010,560,047Method and apparatus for predicting degradation in power modules202010,523,007Facility with decoupled adaptive sensor system201910,520,263Apparatus, system, and method for interior fluid flow with optimized fin structures201910,516,194Thermal management solution for battery pack201910,495,387Multi-layer wick structures with surface enhancement and fabrication methods201910,489,525Systems and methods for composite thermal interface material microstructure property prediction201910,481,651Integrated PCU and GPU cooling system201910,479,218Electric vehicle power system with shared converter201910,453,777Power electronics assemblies with cio bonding layers and double sided cooling, and vehicles incorporating the same201910,423,739Methods for orienting material physical properties using constraint transformation and isoparametric shape functions201910,424,528Layered cooling structure including insulative layer and multiple metallization layers201910,403,594Hybrid bonding materials comprising ball grid arrays and metal inverse opal bonding layers, and power electronics assemblies incorporating the same201910,395,940Method of etching microelectronic mechanical system features in a silicon wafer201910,385,469Thermal stress compensation bonding layers and power electronics assemblies incorporating the same201910,388,590Cooling bond layer and power electronics assemblies incorporating the same201910,388,810Power electronics assemblies having opticondistors and an embedded active cooling chip201910,381,901Wireless in-wheel electric assemblies with integrated in-wheel cooling and vehicles incorporating the same201910,347,601Power electronics assemblies with metal inverse opal bonding, electrical contact and cooling layers, and vehicles incorporating the same201910,330,400Self-assembled or reconfigurable structures for heat flow control devices201910,334,756Manifold structures having an integrated fluid channel system and assemblies comprising the same201910,290,911Cooling loops and vehicles incorporating the same201910,279,676Hybrid vehicle with in wheel motor and rankine cycle system201910,267,568Programmable ultrasonic thermal diodes201910,252,610Electric vehicle and fuel cell vehicle with rankine cycle201910,239,402Hybrid vehicle with rankine cycle system, in-wheel motor and power module integrated with power train components201910,231,364Fluidly cooled power electronics assemblies having a thermo-electric generator201910,224,265Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system201910,209,016Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same201910,206,310Electronics assemblies incorporating three-dimensional heat flow structures201910,192,814Electronic assemblies having a cooling chip layer with fluid channels and through substrate vias201910,193,047Electronic assemblies incorporating heat flux routing structures for thermoelectric generation201910,176,316Systems and methods for providing and detecting thermal energy patterns in electronic devices201910,157,817Chip-scale cooling device having through-silicon vias and flow directing features201810,149,413Integrated thermal management assembly for gate drivers and power components201810,121,729Power electronics assemblies having a semiconductor device with metallized embedded cooling channels201810,082,047Rapid warm-up schemes of engine and engine coolant for higher fuel efficiency201810,083,917Power electronics assemblies and vehicles incorporating the same201810,066,876Vapor chamber heat flux rectifier and thermal switch201810,032,694Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system201810,028,413Heat transfer management apparatuses having a composite lamina201810,020,243Power electronics assemblies having a wide bandgap semiconductor device and an integrated fluid channel system201810,011,222On touch self-light growth steering wheel20189,990,457Switching circuit including wire traces to reduce the magnitude of voltage and current oscillations20189,980,415Configurable double-sided modular jet impingement assemblies for electronics cooling20189,974,208Pool boiling system20189,914,337'Vehicle with adsorption-based thermal battery'20189,869,520'Heat transfer management apparatuses having a composite lamina'20189,845,018Self-aligning wireless power transfer20179,810,129'Integrated waste heat recovery and motor assisted turbocharger system'20179,799,935'Electrical energy production system'20179,780,279'Thermo-electrochemical cell energy recovery system'20179,779,199'Circuit boards with thermal control and methods for their design'20179,738,056'Systems of bonded substrates and methods for bonding substrates'20179,699,883'Thermal switches for active heat flux alteration'20179,656,536'System for cooling a vehicle compartment'20179,622,380'Two-phase jet impingement cooling devices and electronic device assemblies incorporating the same'20179,604,534'Self-powered active grille shutter system'20179,584,061'Electric drive systems including smoothing capacitor cooling devices and systems'20179,576,088'Methods for orienting material physical properties using constraint transformation and isoparametric shape functions'20179,560,790'Power electronics cooling system with two-phase cooler'20179,511,549'Anisotropic thermal energy guiding shells and methods for fabricating thermal energy guiding shells'20169,496,214'Power electronics devices having thermal stress reduction elements'20169,484,283'Modular jet impingement cooling apparatuses with exchangeable jet plates'20169,478,478'Electronic device assemblies and vehicles employing dual phase change materials'20169,445,526'Modular jet impingement assemblies with passive and active flow control for electronics cooling'20169,437,523'Two-sided jet impingement assemblies and power electronics modules comprising the same'20169,433,074'Printed wiring boards having thermal management features and thermal management apparatuses comprising the same'20169,353,999'Cooling apparatuses and electronics modules having branching microchannels'20169,320,171'Two-phase cooling systems, power electronics modules, and methods for extending maximum heat flux'20169,247,679'Jet impingement coolers and power electronics modules comprising the same'20169,231,309'Metamaterial magnetic field guide'20169,099,295'Cooling apparatuses having sloped vapor outlet channels'20159,086,069'Cooling apparatuses, electronic device assemblies, and cooling assemblies using magnetic shape memory members'20159,062,688'Diaphragm pump'20158,963,664'Magnetic field manipulation devices'20158,929,074'Electronic device assemblies and vehicles employing dual phase change materials'20158,921,989'Power electronics modules with solder layers having reduced thermal stress'20148,842,435'Two-phase heat transfer assemblies and power electronics incorporating the same'20148,797,702'Focusing device for low frequency operation'20148,786,078'Vehicles, power electronics modules and cooling apparatuses with single-phase and two-phase surface enhancement features'20148,736,128'Three dimensional magnetic field manipulation in electromagnetic devices'20148,736,136'Magnetic field manipulation in switched reluctance motors and design method'20148,730,674'Magnetic fluid cooling devices and power electronics assemblies'20148,681,496'Cooling apparatuses, electronic device assemblies, and cooling assemblies using magnetic shape memory members'20148,659,896'Cooling apparatuses and power electronics modules'20148,654,541'Three-dimensional power electronics packages'20148,643,173'Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features'20148,570,128'Magnetic field manipulation devices and actuators incorporating the same'20138,552,283'Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems'20138,516,831'Thermal energy steering device'20138,482,919'Power electronics card assemblies, power electronics modules, and power electronics devices'20138,451,080'Magnetic field focusing for actuator applications'20138,427,832'Cold plate assemblies and power electronics modules'20138,391,008'Power electronics modules and power electronics module assemblies'20138,305,755'Power modules, cooling devices and methods thereof'20128,243,451'Cooling member for heat containing device'20128,203,839'Cooling devices, power modules, and vehicles incorporating the same'20128,199,505'Jet impingement heat exchanger apparatuses and power electronics modules'20128,077,460'Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2021Patents assigned to TOYOTA ENG & MFG NORTH AMERICA (118)· patent assignee history
2011–2016Patents assigned to DEDE ERCAN MEHMET (24)· patent assignee history
2011–2021Based in Ann Arbor, MI, US· patent location history
2013–2016Patents assigned to LEE JAEWOOK (7)· patent assignee history
2013–2014Patents assigned to BANERJEE DEBASISH (5)· patent assignee history
2016–2017Patents assigned to TOYOTA MOTOR ENG & MFG NORTH AMERICA INC (19)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOYOTA ENG & MFG NORTH AMERICA | 118 | 2011–2021 |
| DEDE ERCAN MEHMETself | 24 | 2011–2016 |
| TOYOTA MOTOR ENG & MFG NORTH AMERICA INC | 19 | 2016–2017 |
| LEE JAEWOOK | 7 | 2013–2016 |
| BANERJEE DEBASISH | 5 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ann Arbor, MI, US | 137 | 2011–2021 |