Inventor
Genki Yano
Inventor
Beppu, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
B81BMicrostructural devices or systems, e.g. micromechanical devices13%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems13%
B23KSoldering or unsoldering4%
PatentTitleYear
10,763,230Integrated circuit backside metallization202010,723,616Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip202010,658,240Semiconductor die singulation202010,233,074Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip20199,896,330'Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip'20189,543,206'Wafer die separation'20179,230,862'Wafer die separation'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2020Patents assigned to TEXAS INSTRUMENTS INC (7)· patent assignee history
2016–2020Based in Beppu, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 7 | 2016–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beppu, JP | 7 | 2016–2020 |