Inventor
SUNGDONG CHO
Inventor
KR
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10BElectronic memory devices12%
H10DInorganic electric semiconductor devices12%
H04WWireless communication networks3%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use3%
G01RMeasuring electric variables2%
G08GTraffic control systems2%
H04LTransmission of digital information, e.g. telegraphic communication2%
PatentTitleYear
12,582,011Device including first structure having peripheral circuit and second structure having gate layers202612,557,639Semiconductor devices202612,500,189Semiconductor package202512,334,438Semiconductor device202512,183,680Semiconductor memory device including wiring contact plugs202412,176,245Semiconductor chip structure202412,096,319Method by which first device transmits message in wireless communication system supporting sidelink, and device therefor202411,990,450Device including first structure having peripheral circuit and second structure having gate layers202411,901,297Semiconductor memory device including wiring contact plugs202411,848,285Semiconductor chip including buried dielectric pattern at edge region, semiconductor package including the same, and method of fabricating the same202311,832,184System and method for exchanging data or signals for vehicle202311,798,866Semiconductor device including via structures with undercut portions and semiconductor package including the same202311,791,242Semiconductor device202311,735,498Through via electrode and device isolation structure including oxide layer pattern and nitride layer pattern sequentially stacked on inner surface of trench202311,705,379Semiconductor packages202311,569,171Semiconductor memory device including wiring contact plugs202311,380,606Semiconductor device including via structure with head and body portions2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (15)· patent assignee history
2022–2026Based in KR· patent location history
2023–2024Patents assigned to LG ELECTRONICS INC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 15 | 2022–2026 |
| LG ELECTRONICS INC | 2 | 2023–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 17 | 2022–2026 |