Inventor

Jin Su Kim

Inventor

Seoul, KR

Overview

69→

Patents

2000–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 69 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices13%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%

G02BOptical elements, systems or apparatus7%

F21SNon-portable lighting devices6%

F21VFunctional features or details of lighting devices or systems thereof5%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%

F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted5%

H05KPrinted circuits5%

B60QArrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general4%

H10DInorganic electric semiconductor devices3%

PatentTitleYear

11,042,394Method for processing input and output on multi kernel system and apparatus for the same2021 10,879,189Semiconductor device and method for manufacturing the same2020 10,825,775Semiconductor package integrating active and passive components with electromagnetic shielding2020 10,791,124Method and terminal device for encrypting message2020 10,767,837Optical member and lighting device using the same2020 10,763,217Semiconductor package and antenna module including the same2020 10,756,021Semiconductor package2020 10,727,212Semiconductor package2020 10,567,661Electronic apparatus and controlling method thereof2020 10,522,497Fan-out semiconductor package2019 10,504,825Fan-out semiconductor package2019 10,475,776Fan-out semiconductor package module2019 10,475,748Fan-out semiconductor package2019 10,457,595Laser welded glass packages2019 10,453,788Fan-out semiconductor package2019 10,437,145Method of detaching a pellicle from a photomask2019 10,410,961Fan-out semiconductor package2019 10,403,579Semiconductor device and method for manufacturing the same2019 10,379,283Lighting device having diffuser with array of 3D elements2019 10,345,698Method for fabricating semiconductor device2019 10,347,586Fan-out semiconductor package2019 10,347,556Passivation layer having opening for under bump metallurgy2019 10,338,297Lighting device using line shaped beam2019 10,317,607Optical member having three-dimensional effect forming portion and multiple effect forming portion and lighting device using the same2019 10,312,195Fan-out semiconductor package2019 10,253,550Vacuum insulated glass units and methodology for manufacturing the same2019 10,163,746Semiconductor package with improved signal stability and method of manufacturing the same2018 10,151,869Optical member and lighting device using the same2018 10,125,948Optical member and lighting device using the same2018 10,128,676Method and apparatus for charging a battery2018 10,073,210Light source module and lighting device having the same2018 10,026,668Passivation layer having an opening for under bump metallurgy2018 9,997,504Electronic device module and method of manufacturing the same2018 9,966,393Array substrate and method of fabricating the same2018 9,952,376Lighting device using line shaped beam2018 9,897,282'Optical member and lighting device using the same'2018 9,880,462'Pellicle and exposure mask including the same'2018 9,766,390'Optical member having three-dimensional effect forming portion and multiple effect forming portion and lighting device using the same'2017 9,732,939'Optical member and lighting device using the same'2017 9,733,417'Lighting device with light diffusing element'2017 9,695,499'Nanowire manufacturing kit having nanowire manufacturing substrate and nanowire adhesive film and nanowire manufactured using the same'2017 9,609,735'Electrode substrate and touch panel'2017 9,599,762'Wire grid polarizer, liquid crystal device including the wire grid polarizer, 3-D stereoscopic image display device including the wire grid polarizer, and method of manufacturing the wire grid polarizer'2017 9,536,819'Transparent substrate having nano pattern and method of manufacturing the same'2017 9,532,462'Printed circuit board and manufacturing method thereof'2016 9,530,802'Array substrate and method of fabricating the same'2016 9,496,215'Transparent substrate having nano pattern and method of manufacturing the same'2016 9,491,866'Method for manufacturing a printed circuit board'2016 9,488,764'Wire grid polarizer and backlight unit using the same'2016 9,456,501'Nanowire grid structure having grid patterns and a sacrificial layer'2016 9,413,443'Electronic device including antenna and method of controlling the same'2016 9,341,941'Reflective photomask blank, reflective photomask, and integrated circuit device manufactured by using reflective photomask'2016 9,314,212'X-ray imaging apparatus'2016 9,265,161'Method of manufacturing an embedded printed circuit board'2016 9,158,052'Method for manufacturing a wire grid polarizer'2015 9,069,090'Apparatus and method of determining optimal energy window for optimal positron emission tomography'2015 8,956,962'Method for fabricating large-area nanoscale pattern'2015 D0719926'Semiconductor device'2014 D0719113'Semiconductor device'2014 D0717255'Semiconductor device'2014 8,821,740'Nanowire manufacturing method'2014 8,800,137'Method of manufacturing printed circuit board'2014 8,786,064'Semiconductor package and method for manufacturing the same and semiconductor package module having the same'2014 D0631464'Cellular phone'2011 D0597990'Cellular phone'2009 D0573973'Mobile phone'2008 7,329,365'Etchant composition for indium oxide layer and etching method using the same'2008 6,188,129'Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer'2001 6,124,149'Method of making stackable semiconductor chips to build a stacked chip module'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (21)· patent assignee history

2008–2018Based in Gyeonggi-do, KR· patent location history

2011–2020Based in Seoul, KR· patent location history

2014–2020Patents assigned to LG INNOTEK CO LTD (24)· patent assignee history

2014–2019Patents assigned to SAMSUNG ELECTRO MECH (11)· patent assignee history

2014–2017Patents assigned to KIM JIN SU (10)· patent assignee history

2014–2017Patents assigned to LEE JUN (5)· patent assignee history

2014Based in Kyungki-do, KR· patent location history

2016–2019Based in Hwaseong-si, KR· patent location history

2018–2020Based in Suwon-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
LG INNOTEK CO LTD	24	2014–2020
SAMSUNG ELECTRONICS CO LTD	21	2008–2020
SAMSUNG ELECTRO MECH	11	2014–2019
KIM JIN SUself	10	2014–2017
LEE JUN	5	2014–2017

Locations

Location	Patents	Span
Seoul, KR	32	2011–2020
Suwon-si, KR	18	2018–2020
Hwaseong-si, KR	4	2016–2019
Gyeonggi-do, KR	4	2008–2018
Kyungki-do, KR	3	2014