Inventor
Masood Murtuza
Inventor
Sugarland, TX, US
Overview
Patents· 31 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1051%
H05KPrinted circuits14%
H10DInorganic electric semiconductor devices8%
Y02PClimate change mitigation technologies in the production or processing of goods8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
H01LSemiconductor devices5%
B23KSoldering or unsoldering2%
C09JAdhesives2%
G01MTesting static or dynamic balance of machines or structures2%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
10,867,979Circuit mounting structure and lead frame for system in package (SIP) devices202010,714,430EMI shield for molded packages202010,204,890Substrate for system in package (SIP) devices20199,354,138'Fixture for test circuit board reliability testing'20168,716,068'Method for contacting agglomerate terminals of semiconductor packages'20148,643,165'Semiconductor device having agglomerate terminals'20148,436,475'IC device having low resistance TSV comprising ground connection'20138,431,481'IC device having low resistance TSV comprising ground connection'20138,178,976'IC device having low resistance TSV comprising ground connection'20128,154,134'Packaged electronic devices with face-up die having TSV connection to leads and die pad'20128,039,309'Systems and methods for post-circuitization assembly'20118,017,439'Dual carrier for joining IC die or wafers to TSV wafers'20117,915,080'Bonding IC die to TSV wafers'20117,883,936'Multi layer low cost cavity substrate fabrication for PoP packages'20117,790,597'Solder cap application process on copper bump using solder powder film'20107,642,649'Support structure for low-k dielectrics'20107,635,914'Multi layer low cost cavity substrate fabrication for pop packages'20097,445,960'Adhesion by plasma conditioning of semiconductor chip'20087,323,405'Fine pitch low cost flip chip substrate'20087,319,275'Adhesion by plasma conditioning of semiconductor chip'20087,276,401'Adhesion by plasma conditioning of semiconductor chip surfaces'20077,271,494'Adhesion by plasma conditioning of semiconductor chip surfaces'20077,057,284'Fine pitch low-cost flip chip substrate'20066,900,534'Direct attach chip scale package'20056,888,255'Built-up bump pad structure and method for same'20056,869,831'Adhesion by plasma conditioning of semiconductor chip surfaces'20056,849,944'Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad'20056,717,276'Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly'20046,396,136'Ball grid package with multiple power/ground planes'20026,020,630'Tape automated bonding package for a semiconductor chip employing corner member cross-slots'20005,586,010'Low stress ball grid array package'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2016Patents assigned to TEXAS INSTRUMENTS INC (28)· patent assignee history
1996–2013Based in Sugarland, TX, US· patent location history
2005–2020Based in Sugar Land, TX, US· patent location history
2012–2014Patents assigned to MURTUZA MASOOD (5)· patent assignee history
2012–2013Patents assigned to BONIFIELD THOMAS D (4)· patent assignee history
2012–2013Patents assigned to CHAUHAN SATYENDRA S (4)· patent assignee history
2012–2013Patents assigned to DUNNE RAJIV (4)· patent assignee history
2016Based in Stafford, TX, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 28 | 1996–2016 |
| MURTUZA MASOODself | 5 | 2012–2014 |
| BONIFIELD THOMAS D | 4 | 2012–2013 |
| CHAUHAN SATYENDRA S | 4 | 2012–2013 |
| DUNNE RAJIV | 4 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Sugarland, Texas, US | 19 | 1996–2013 |
| Sugar Land, Texas, US | 11 | 2005–2020 |
| Stafford, Texas, US | 1 | 2016 |