Inventor
HOECHUL KIM
Inventor
KR
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation15%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
PatentTitleYear
12,456,631Method of manufacturing semiconductor device202512,224,262Substrate bonding apparatus and method of manufacturing semiconductor device by using the same202512,136,602Method of fabricating a semiconductor device202411,990,444Substrate bonding apparatus and method of manufacturing semiconductor device by using the same202411,728,197Wafer to wafer bonding apparatus and wafer to wafer bonding method202311,721,562Substrate bonding apparatus202311,594,443Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatus202311,152,317Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (8)· patent assignee history
2021–2025Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 8 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 8 | 2021–2025 |