Inventor

DAVID MOORE

Inventor
US

Overview

23→
Patents
2021–2026
Patent span
Performing operations
Primary field (CPC B)

Patents· 23 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B33Yprimary
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering13%
B29CShaping or joining of plastics11%
G06FElectric digital data processing7%
B01DSeparation6%
H03KPulse technique6%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts4%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds4%
H01LSemiconductor devices4%
H03LAutomatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
PatentTitleYear
12,561,687Decentralized digital identity exchange for fraud detection202612,546,547Firearm platform and method of connecting upper and lower receivers202612,535,851Digital system synchronization202612,425,014Self-aligning interconnect for a digital system202512,409,603Build plates for continuous liquid interface printing having permeable base and adhesive for increasing permeability and related methods, systems and devices202512,330,120Spiral wound membrane element for high temperature filtration202512,275,862Foul release coating composition202512,215,050Additive manufacturing phase separating compositions to prepare glasses and ceramics202512,107,961Connection resilient multi-factor authentication202412,019,464Digital system synchronization202411,993,015Build plate assemblies for continuous liquid interphase printing having lighting panels and related methods, systems and devices2024D1002623Network interface device bracket202311,796,800Tracking system202311,685,117Three-dimensional printing methods for reducing bubbles by de-gassing through build plate202311,607,649Spiral wound membrane element for high temperature filtration202311,518,096Three-dimensional printing with build plates having surface topologies for increasing permeability and related methods202211,446,097User console system for robotic surgery202211,440,160Guards for use with power tools and power tools including such guards202211,438,524Automated rack imaging202211,407,897Zwitterion-functionalized multicomponent copolymers and associated polymer blends and membranes2022D0945234Guard for use with a power tool202211,220,051Build plate assemblies for continuous liquid interphase printing having lighting panels and related methods, systems and devices202211,148,357Method of making composite objects by additive manufacturing2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2025Patents assigned to CARBON INC (6)· patent assignee history
2021–2026Based in US· patent location history
2023–2025Patents assigned to BL TECHNOLOGIES INC (2)· patent assignee history
2023–2025Based in GB· patent location history
2024–2026Patents assigned to MOVELLUS CIRCUITS INC (3)· patent assignee history
2024–2026Patents assigned to Movellus Circuits Incorporated (3)· patent assignee history
2024–2026Patents assigned to IBM (2)· patent assignee history
2024–2026Based in AU· patent location history
2025Based in CH· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CARBON INC62021–2025
MOVELLUS CIRCUITS INC32024–2026
Movellus Circuits Incorporated32024–2026
BL TECHNOLOGIES INC22023–2025
IBM22024–2026
Locations
LocationPatentsSpan
US182021–2026
AU22024–2026
GB22023–2025
CH12025