Inventor
Yinon Degani
Inventor
Highland Park, NJ, US
Overview
Patents· 57 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H05KPrinted circuits21%
B23KSoldering or unsoldering8%
G01RMeasuring electric variables5%
H10DInorganic electric semiconductor devices5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
G02BOptical elements, systems or apparatus4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
B81BMicrostructural devices or systems, e.g. micromechanical devices2%
PatentTitleYear
11,096,891Hybrid muco-adhesive delivery systems and use thereof20218,102,021'RF devices'20128,018,027'Flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductor'20117,936,043'Integrated passive device substrates'20117,795,709'Shielding noisy conductors in integrated passive devices'20107,692,511'Compact balun transformers'20107,382,056'Integrated passive devices'20087,355,264'Integrated passive devices with high Q inductors'20087,259,077'Integrated passive devices'20077,170,754'SDIO memory and interface card'20077,061,258'Testing integrated circuits'20066,867,607'Membrane test method and apparatus for integrated circuit testing'20056,734,539'Stacked module package'20046,680,212'Method of testing and constructing monolithic multi-chip modules'20046,678,167'High performance multi-chip IC package'20046,597,069'Flip chip metallization'20036,560,735'Methods and apparatus for testing integrated circuits'20036,437,990'Multi-chip ball grid array IC packages'20026,433,411'Packaging micromechanical devices'20026,396,711'Interconnecting micromechanical devices'20026,370,766'Manufacture of printed circuit cards'20026,369,444'Packaging silicon on silicon multichip modules'20026,342,399'Testing integrated circuits'20026,282,100'Low cost ball grid array package'20016,251,705'Low profile integrated circuit packages'20016,232,212'Flip chip bump bonding'20016,175,158'Interposer for recessed flip-chip package'20016,160,715'Translator for recessed flip-chip package'20006,154,370'Recessed flip-chip package'20006,130,141'Flip chip metallization'20006,100,475'Solder bonding printed circuit boards'20006,077,725'Method for assembling multichip modules'20006,074,897'Integrated circuit bonding method and apparatus'20006,043,670'Method for testing integrated circuits'20006,015,652'Manufacture of flip-chip device'20006,013,877'Solder bonding printed circuit boards'20005,990,564'Flip chip packaging of memory chips'19995,904,859'Flip chip metallization'19995,869,894'RF IC package'19995,796,900'Apparatus and methods for interconnecting arrays of optical transmission paths employing externally located connector pads'19985,778,913'Cleaning solder-bonded flip-chip assemblies'19985,646,828'Thin packaging of multi-chip modules with enhanced thermal/power management'19975,608,262'Packaging multi-chip modules without wire-bond interconnection'19975,564,617'Method and apparatus for assembling multichip modules'19965,516,728'Process for fabircating an integrated circuit'19965,505,367'Method for bumping silicon devices'19965,473,512'Electronic device package having electronic device boonded, at a localized region thereof, to circuit board'19955,385,290'Soldering material and procedure'19955,382,300'Solder paste mixture'19955,346,118'Surface mount solder assembly of leadless integrated circuit packages to substrates'19945,211,764'Solder paste and method of using the same'19935,150,832'Solder paste'19925,125,560'Method of soldering including removal of flux residue'19925,091,988'Article for connecting optical fibers'19925,037,476'Process for improving photostability of titanium dioxide pigments in binder compositions without decreasing reflectivity'19914,973,126'Optical fiber connector'19904,946,236'Movable fiber optical switch'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–1994Patents assigned to AT & T BELL LAB (8)· patent assignee history
1990–2012Based in Highland Park, NJ, US· patent location history
1995–1996Patents assigned to AT & T CORP (5)· patent assignee history
1996–2004Patents assigned to LUCENT TECHNOLOGIES INC (25)· patent assignee history
1998–1999Based in Middlesex, NJ, US· patent location history
2001–2002Patents assigned to AGERE SYST GUARDIAN CORP (6)· patent assignee history
2005–2012Patents assigned to SYCHIP INC (10)· patent assignee history
2021Based in Yehud, IL· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LUCENT TECHNOLOGIES INC | 25 | 1996–2004 |
| SYCHIP INC | 10 | 2005–2012 |
| AT & T BELL LAB | 8 | 1990–1994 |
| AGERE SYST GUARDIAN CORP | 6 | 2001–2002 |
| AT & T CORP | 5 | 1995–1996 |
Locations
| Location | Patents | Span |
|---|---|---|
| Highland Park, New Jersey, US | 54 | 1990–2012 |
| Middlesex, New Jersey, US | 2 | 1998–1999 |
| Yehud, IL | 1 | 2021 |