Inventor

Cheng-Chieh Hsieh

Inventor

Tainan, TW

Overview

2018–2021

Patent span

Electricity

Primary field (CPC H)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices20%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%

G06FElectric digital data processing7%

G11CStatic stores7%

H04BTransmission7%

H10BElectronic memory devices7%

H10DInorganic electric semiconductor devices7%

H10NElectric solid-state devices not otherwise provided for7%

LOC147%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2018Patents assigned to BENQ CORP (1)· patent assignee history

2018Based in Taipei, TW· patent location history

2019Patents assigned to LYFT INC (1)· patent assignee history

2019Based in San Francisco, CA, US· patent location history

2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history

2021Patents assigned to GLOBALFOUNDRIES SG PTE LTD (1)· patent assignee history

2021Based in Tainan, TW· patent location history

2021Based in Singapore, SG· patent location history

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	2	2021
BENQ CORP	1	2018
GLOBALFOUNDRIES SG PTE LTD	1	2021
LYFT INC	1	2019

Locations