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Inventor

Jonathon G. Greenwood

Inventor
Boise, ID, US

Overview

21→
Patents
1995–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 21 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H01LSemiconductor devices11%
H05KPrinted circuits11%
H10HInorganic light-emitting semiconductor devices having potential barriers11%
B23KSoldering or unsoldering7%
B29CShaping or joining of plastics2%
G02BOptical elements, systems or apparatus2%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light2%
H10DInorganic electric semiconductor devices2%
PatentTitleYear
11,081,625Packaged LEDs with phosphor films, and associated systems and methods20219,735,136'Method for embedding silicon die into a stacked package'20178,936,953'Light emitting diode thermally enhanced cavity package and method of manufacture'20158,878,205'Light emitting diode wafer-level package with self-aligning features'20148,872,310'Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication'20148,598,612'Light emitting diode thermally enhanced cavity package and method of manufacture'20138,441,020'Light emitting diode wafer-level package with self-aligning features'20138,344,514'Semiconductor device structures and electronic devices including same hybrid conductive vias'20137,939,449'Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends'20116,807,218'Laser module and optical subassembly'20046,596,212'Method and apparatus for increasing thickness of molded body on semiconductor package'20036,593,545'Laser defined pads for flip chip on leadframe package fabrication method'20036,577,012'Laser defined pads for flip chip on leadframe package'20036,338,985'Making chip size semiconductor packages'20025,716,760'Method for plating a substrate to eliminate the use of a solder mask'19985,679,498'Method for producing high density multi-layer integrated circuit carriers'19975,647,123'Method for improving distribution of underfill between a flip chip die and a circuit board'19975,625,224'Method and apparatus for an integrated circuit chip carrier having improved mounting pad density'19975,598,967'Method and structure for attaching a circuit module to a circuit board'19975,444,303'Wire bond pad arrangement having improved pad density'19955,431,332'Method and apparatus for solder sphere placement using an air knife'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995–1998Patents assigned to MOTOROLA INC (7)· patent assignee history
1995–1998Based in Boynton Beach, FL, US· patent location history
1995Based in Lake Worth, FL, US· patent location history
2002–2004Patents assigned to AMKOR TECHNOLOGY INC (5)· patent assignee history
2002–2004Based in Phoenix, AZ, US· patent location history
2011–2021Patents assigned to MICRON TECHNOLOGY INC (9)· patent assignee history
2011–2021Based in Boise, ID, US· patent location history
2013–2017Patents assigned to GREENWOOD JONATHON G (4)· patent assignee history
2013Patents assigned to COBBLEY CHAD A (1)· patent assignee history
2014Based in Saratoga Springs, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC92011–2021
MOTOROLA INC71995–1998
AMKOR TECHNOLOGY INC52002–2004
GREENWOOD JONATHON Gself42013–2017
COBBLEY CHAD A12013
Locations
LocationPatentsSpan
Boise, ID, US82011–2021
Boynton Beach, Florida, US61995–1998
Phoenix, AZ, US52002–2004
Saratoga Springs, New York, US12014
Lake Worth, Florida, US11995