Inventor
Sayaka Nishi
Inventor
Osaka, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Bprimary
H05BElectric heating30%
H01LSemiconductor devices20%
H10HInorganic light-emitting semiconductor devices having potential barriers20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
Y10TTechnical subjects covered by former us classification10%
PatentTitleYear
9,247,604'Lighting device'20169,119,271'Lighting device to produce preferable preception of skin color'20159,041,277'Lighting device'20157,791,209'Method of underfill air vent for flipchip BGA'20107,489,519'Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGA'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2010Patents assigned to IBM (2)· patent assignee history
2009–2010Based in Yamato, JP· patent location history
2015–2016Patents assigned to PANASONIC IP MAN CO LTD (3)· patent assignee history
2015Patents assigned to PANASONIC CORP (2)· patent assignee history
2015–2016Based in Osaka, JP· patent location history
2016Patents assigned to HAMANO HIROSHI (1)· patent assignee history
2016Patents assigned to KARASAWA YOSHINORI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PANASONIC IP MAN CO LTD | 3 | 2015–2016 |
| IBM | 2 | 2009–2010 |
| PANASONIC CORP | 2 | 2015 |
| HAMANO HIROSHI | 1 | 2016 |
| KARASAWA YOSHINORI | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 3 | 2015–2016 |
| Yamato, JP | 2 | 2009–2010 |