Inventor
Koji Monden
Inventor
Nagoya, JP
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material29%
G01NInvestigating or analysing materials by determining their chemical or physical properties14%
H10DInorganic electric semiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests14%
Y10TTechnical subjects covered by former us classification14%
PatentTitleYear
7,507,587'Automatic analysis and control system for electroless composite plating solution'20096,273,943'Electroless composite Plating Solution and Electroless composite plating method'20015,804,474'Method for forming a V-shaped gate electrode in a semiconductor device, and the structure of the electrode'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998Patents assigned to MURATA MANUFACTURING CO (1)· patent assignee history
1998Based in Omihachiman, JP· patent location history
2001Patents assigned to UYEMURA C & CO LTD (1)· patent assignee history
2001Based in Hirakata, JP· patent location history
2009Patents assigned to UYEMURA CO LTD C (1)· patent assignee history
2009Based in Nagoya, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MURATA MANUFACTURING CO | 1 | 1998 |
| UYEMURA C & CO LTD | 1 | 2001 |
| UYEMURA CO LTD C | 1 | 2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagoya, JP | 1 | 2009 |
| Hirakata, JP | 1 | 2001 |
| Omihachiman, JP | 1 | 1998 |