LexDanaLexDanabeta
Inventor

Yuan Zang

Inventor
Tianjin, CN

Overview

3→
Patents
2014–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
10,037,935Lead frame with dummy leads for burr mitigation during encapsulation20189,997,445Substrate interconnections for packaged semiconductor device20188,901,721'Lead frame based semiconductor die package'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014Patents assigned to BAI ZHIGANG (1)· patent assignee history
2014Patents assigned to FREESCALE SEMICONDUCTOR INC (1)· patent assignee history
2014Patents assigned to YAO JINZHONG (1)· patent assignee history
2014Patents assigned to ZANG YUAN (1)· patent assignee history
2014–2018Based in Tianjin, CN· patent location history
2018Patents assigned to NXP USA INC (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NXP USA INC22018
BAI ZHIGANG12014
FREESCALE SEMICONDUCTOR INC12014
YAO JINZHONG12014
ZANG YUANself12014
Locations
LocationPatentsSpan
Tianjin, CN32014–2018