Inventor

Shogo Okita

Inventor
Hyogo, JP

Overview

46→
Patents
2010–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 46 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
H01LSemiconductor devices27%
H01JElectric discharge tubes or discharge lamps17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H10DInorganic electric semiconductor devices3%
B44CProducing decorative effects2%
F27DDetails or accessories of furnaces, kilns, ovens or retorts, in so far as they are of kinds occurring in more than one kind of furnace2%
H05KPrinted circuits1%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests1%
B23KSoldering or unsoldering1%
PatentTitleYear
11,101,112Plasma processing device and plasma processing method202110,964,597Element chip manufacturing method202110,923,357Element chip and manufacturing process thereof202110,923,362Manufacturing process of element chip202110,896,849Method of dicing a semiconductor wafer using a protective film formed by coating a mixture of water-soluble resin and organic solvent202110,892,190Manufacturing process of element chip202110,818,553Method for cutting element chip by laser scribing202010,763,124Manufacturing process of element chip202010,714,356Plasma processing method202010,497,622Element chip manufacturing method201910,475,704Method of manufacturing element chip and element chip201910,424,488Method of manufacturing electronic component201910,361,111Plasma processing apparatus and plasma processing method201910,297,487Element chip manufacturing method201910,297,489Plasma processing method and plasma processing apparatus201910,276,423Method of manufacturing element chip201910,242,914Element chip manufacturing method201910,236,266Element chip manufacturing method201910,217,617Plasma processing apparatus and method therefor201910,177,063Element chip and method for manufacturing the same201910,049,933Element chip manufacturing method201810,037,891Manufacturing method of element chip201810,026,619Plasma treatment method20189,953,906Method of manufacturing element chip, method of manufacturing electronic component-mounted structure, and electronic component-mounted structure20189,941,132Plasma processing apparatus and plasma processing method20189,941,167Method for manufacturing element chip20189,922,899'Method of manufacturing element chip and element chip'20189,911,677'Element chip and method for manufacturing the same'20189,911,638'Plasma processing apparatus and plasma processing method'20189,859,144'Method of manufacturing element chip'20189,799,495'Plasma processing apparatus and plasma processing method'20179,786,472'Plasma processing apparatus and method for manufacturing electronic component'20179,780,021'Method of manufacturing element chip, method of manufacturing electronic component-mounted structure, and electronic component-mounted structure'20179,698,073'Method of manufacturing element chip and element chip'20179,698,052'Method of manufacturing element chip and method of manufacturing electronic component-mounted structure using plasma etch to singulate element chip'20179,620,336'Plasma processing apparatus and method therefor'20179,570,272'Plasma processing apparatus and plasma processing method'20179,502,220'Plasma processing apparatus and plasma processing method'20169,073,385'Plasma processing method for substrates'20158,883,025'Plasma processing apparatus and plasma processing method'20148,673,166'Plasma processing apparatus and plasma processing method'20148,591,754'Plasma processing apparatus and plasma processing method'20138,563,332'Wafer reclamation method and wafer reclamation apparatus'20138,303,765'Plasma etching apparatus'20128,231,798'Plasma processing apparatus and plasma processing method'20127,736,528'Plasma processing apparatus and plasma processing method'2010

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010–2014Patents assigned to PANASONIC CORP (7)· patent assignee history
2010–2021Based in Hyogo, JP· patent location history
2012–2015Patents assigned to OKITA SHOGO (7)· patent assignee history
2012–2013Patents assigned to SUZUKI HIROYUKI (4)· patent assignee history
2012–2014Patents assigned to WATANABE SYOUZOU (4)· patent assignee history
2015–2021Patents assigned to PANASONIC IP MAN CO LTD (39)· patent assignee history
2019Based in Osaka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
PANASONIC IP MAN CO LTD392015–2021
OKITA SHOGOself72012–2015
PANASONIC CORP72010–2014
SUZUKI HIROYUKI42012–2013
WATANABE SYOUZOU42012–2014
Locations
LocationPatentsSpan
Hyogo, JP452010–2021
Osaka, JP12019