Inventor
Hwanpil PARK
Inventor
KR
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,261,093Semiconductor packages having a dam structure202512,136,581Semiconductor package structure and fabrication method thereof202412,033,924Semiconductor package202411,842,941Semiconductor package structure and fabrication method thereof202311,776,913Semiconductor package and a package-on-package including the same202311,437,293Semiconductor packages having a dam structure202211,315,851Semiconductor package structure and fabrication method thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (7)· patent assignee history
2022–2025Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 7 | 2022–2025 |