Inventor
Chong XING
Inventor
CN
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing18%
H04MTelephonic communication18%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds12%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients12%
C08LCompositions of macromolecular compounds12%
G09FDisplaying12%
F16CShafts6%
H05KPrinted circuits6%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution6%
PatentTitleYear
12,503,599Thermal conductive silicone composition202512,449,838Edge protection structure and foldable display terminal202512,411,523Foldable electronic device202512,378,363Thermal conductive silicone composition202512,356,568Electronic device with the folded state and unfolded state2025Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2025Patents assigned to HUAWEI TECH CO LTD (3)· patent assignee history
2025Patents assigned to DOW SILICONES CORP (2)· patent assignee history
2025Based in CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HUAWEI TECH CO LTD | 3 | 2025 |
| DOW SILICONES CORP | 2 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 5 | 2025 |