Inventor
STEVEN A. KLEIN
Inventor
US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Rprimary
H01RElectrically-conductive connections26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H01LSemiconductor devices17%
H05KPrinted circuits17%
G06FElectric digital data processing9%
B23KSoldering or unsoldering4%
B81BMicrostructural devices or systems, e.g. micromechanical devices4%
PatentTitleYear
12,444,664Loading frame for high I/O count packaged semiconductor chip202512,413,001Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package202512,127,363Compression mounted technology (CMT) socket retention mechanisms to board or interposer202411,916,003Varied ball ball-grid-array (BGA) packages202411,818,832Socket load regulation utilizing CPU carriers with shim components202311,646,244Socket loading mechanism for passive or active socket and package cooling202311,581,671Integrated circuit package socket housing to enhance package cooling202311,569,596Pressure features to alter the shape of a socket202311,481,118Storage media programming with adaptive write buffer release2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to MARVELL ASIA PTE LTD (1)· patent assignee history
2022–2025Based in US· patent location history
2023–2025Patents assigned to INTEL CORP (7)· patent assignee history
2025Patents assigned to SK HYNIX NAND PRODUCT SOLUTIONS CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 7 | 2023–2025 |
| MARVELL ASIA PTE LTD | 1 | 2022 |
| SK HYNIX NAND PRODUCT SOLUTIONS CORP | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 9 | 2022–2025 |