Inventor
Tadahiro Nakagawa
Inventor
Fukui, JP
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Gprimary
H01GCapacitors28%
H05KPrinted circuits20%
H01CResistors6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution6%
B05DProcesses for applying fluent materials to surfaces, in general4%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact4%
Y10TTechnical subjects covered by former us classification4%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry2%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling2%
PatentTitleYear
10,156,390Heat storage apparatus and air conditioner having same20189,187,321'Reactor'20158,951,475'Chemical heat accumulator'20156,981,859'Method for manufacturing electronic component and apparatus for manufacturing the same'20066,715,197'Laminated ceramic electronic component and method for manufacturing same'20046,569,367'Method for manufacturing electronic component'20036,433,995'Apparatus for forming electrode of chip-like electronic part'20026,306,456'Electrode of electronic component part and conductive paste coating device'20016,297,942'Metal terminal and electronic component including same'20016,270,613'Process of forming electrode of chip electronic part'20015,632,813'Electrode forming apparatus for chip type electronic components'19975,614,053'Method of press-molding ceramic green sheet laminate'19975,547,511'Electrode forming system for chip components'19965,424,093'Method of manufacturing electronic elements'19955,330,574'Electrode forming apparatus'19945,275,661'Dipping apparatus'19945,249,906'Press machine for chip type electronic components'19935,248,340'Dipping apparatus'19935,080,380'Magnetic chuck'19924,788,931'Tool for forming external electrodes of chip parts'19884,664,943'Method of forming external electrodes of chip parts and tool for practicing same'1987Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–2006Patents assigned to MURATA MANUFACTURING CO (17)· patent assignee history
1987–2006Based in Fukui, JP· patent location history
1992–2001Based in Kyoto, JP· patent location history
1995–2002Based in Nagaokakyo, JP· patent location history
2015Patents assigned to DENSO CORP (2)· patent assignee history
2015Patents assigned to KOMAKI KATSUYA (1)· patent assignee history
2015Patents assigned to MIEDA HIROSHI (1)· patent assignee history
2015Patents assigned to MITSUI HIROYUKI (1)· patent assignee history
2015Based in Nagoya, JP· patent location history
2018Based in Yokohama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MURATA MANUFACTURING CO | 17 | 1987–2006 |
| DENSO CORP | 2 | 2015 |
| KOMAKI KATSUYA | 1 | 2015 |
| MIEDA HIROSHI | 1 | 2015 |
| MITSUI HIROYUKI | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fukui, JP | 7 | 1987–2006 |
| Kyoto, JP | 7 | 1992–2001 |
| Nagaokakyo, JP | 4 | 1995–2002 |
| Yokohama, JP | 1 | 2018 |
| Nagoya, JP | 1 | 2015 |