Inventor
KODAI SHIMONO
Inventor
JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics40%
B29DProducing particular articles from plastics or from substances in a plastic state15%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts15%
B29LIndexing scheme associated with subclass b29c, relating to particular articles10%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form10%
B64FGround or aircraft-carrier-deck installations specially adapted for use in connection with aircraft5%
Y10TTechnical subjects covered by former us classification5%
PatentTitleYear
12,319,019Fiber-reinforced composite material molding apparatus and fiber-reinforced composite material molding method202512,070,914Molding method and molding jig for laminated body202411,707,897Method for producing composite material, fiber base material, and shaping mold for fiber base material202311,648,708Composite material molding jig and composite material, molding method202311,498,289Composite material molding method and composite material molding device202211,440,274Device for manufacturing fiber-reinforced plastic molded article202211,396,141Repair patch, method for molding repair patch, and method for repairing composite material202211,338,529Repair patch, method for molding repair patch, method for repairing composite material, and molding jig2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to MITSUBISHI HEAVY IND LTD (8)· patent assignee history
2022–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI HEAVY IND LTD | 8 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 8 | 2022–2025 |