Inventor

CHIH-MING HUNG

Inventor
US

Overview

18→
Patents
2022–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 18 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Sprimary
G01SRadio direction-finding13%
H01LSemiconductor devices13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
H04BTransmission10%
H01QAntennas, i.e. radio aerials8%
G06VImage or video recognition or understanding5%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
G01RMeasuring electric variables3%
H01PWaveguides3%
PatentTitleYear
12,500,180Semiconductor package with integrated antenna and shielding pillars202512,361,692Method and electronic device for motion prediction202512,282,626Test method for combination of touch sensitive processing apparatus and touch panel, touch sensitive processing method, apparatus, non-transitory computer readable medium, and touch system thereof202512,272,671Semiconductor device package and method for manufacturing the same202512,028,099Semiconductor chip with local oscillator buffer reused for loop-back test and associated loop-back test method202412,015,099Semiconductor sensor and methods thereof202411,837,552Semiconductor package with layer structures, antenna layer and electronic component202311,835,645Reconfigurable RF front end and antenna arrays for radar mode switching202311,821,975Radar module incorporated with a pattern-shaping device202311,693,089Apparatus and method for applying frequency calibration to local oscillator signal derived from reference clock output of active oscillator202311,695,439Semiconductor chip with local oscillator buffer reused for signal transmission and associated transmission method202311,682,653Semiconductor device package and method for manufacturing the same202311,677,433Wireless system having local oscillator signal derived from reference clock output of active oscillator that has no electromechanical resonator202311,601,147Semiconductor chip with local oscillator buffer reused for loop-back test and associated loop-back test method202311,500,084Method and apparatus for performing object detection by using detection threshold values derived from adding different offset values to reference threshold values202211,373,957Semiconductor package with layer structures, antenna layer and electronic component202211,359,943Sensor system interconnect for automatic configuration202211,237,249Apparatus and method for applying frequency calibration to local oscillator signal derived from reference clock output of active oscillator that has no electromechanical resonator2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2025Patents assigned to MEDIATEK INC (14)· patent assignee history
2022–2025Based in US· patent location history
2023–2025Patents assigned to ADVANCED SEMICONDUCTOR ENG (2)· patent assignee history
2023–2025Based in TW· patent location history
2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history
2025Patents assigned to EGALAX_EMPIA TECH INC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MEDIATEK INC142022–2025
ADVANCED SEMICONDUCTOR ENG22023–2025
EGALAX_EMPIA TECH INC12025
TAIWAN SEMICONDUCTOR MFG CO LTD12024
Locations
LocationPatentsSpan
US142022–2025
TW42023–2025