Inventor
Wei Fan
Inventor
Aalborg, DK
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H04Lprimary
H04LTransmission of digital information, e.g. telegraphic communication14%
H04WWireless communication networks14%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
B82YSpecific uses or applications of nanostructures7%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application7%
G01RMeasuring electric variables7%
H01LSemiconductor devices7%
H01RElectrically-conductive connections7%
H04BTransmission7%
H05KPrinted circuits7%
PatentTitleYear
11,105,567Thermal management assembly comprising bulk graphene material202110,128,967Over-the-air test20189,800,486'Throughput characterization'20176,914,445'Modular socket for testing an integrated circuit'20056,866,519'Adaptable resilient pin assembly for BGA based IC encapsulation'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005Based in Jhubei City, TW· patent location history
2017Patents assigned to CARRENO BAUTISTA DE LISBONA XAVIER (1)· patent assignee history
2017Patents assigned to FAN WEI (1)· patent assignee history
2017Patents assigned to FRANEK ONDREJ (1)· patent assignee history
2017Patents assigned to INTEL IP CORP (1)· patent assignee history
2017Patents assigned to IOFFE ANATOLIY (1)· patent assignee history
2017–2018Based in Aalborg, DK· patent location history
2021Based in Strongsville, OH, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CARRENO BAUTISTA DE LISBONA XAVIER | 1 | 2017 |
| FAN WEIself | 1 | 2017 |
| FRANEK ONDREJ | 1 | 2017 |
| INTEL IP CORP | 1 | 2017 |
| IOFFE ANATOLIY | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Aalborg, DK | 2 | 2017–2018 |
| Jhubei City, TW | 2 | 2005 |
| Strongsville, OH, US | 1 | 2021 |