Inventor
John McCormick
Inventor
Redwood City, CA, US
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H05KPrinted circuits13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
Y10TTechnical subjects covered by former us classification11%
G01RMeasuring electric variables10%
Y02PClimate change mitigation technologies in the production or processing of goods8%
H01LSemiconductor devices3%
G01NInvestigating or analysing materials by determining their chemical or physical properties1%
PatentTitleYear
10,418,318Fine pitch copper pillar package and method201910,224,270Fine pitch copper pillar package and method20199,462,690'Fine pitch copper pillar package and method'20168,786,075'Electrical circuit with component-accommodating lid'20148,536,458'Fine pitch copper pillar package and method'20137,041,516'Multi chip module assembly'20066,943,446'Via construction for structural support'20056,777,314'Method of forming electrolytic contact pads including layers of copper, nickel, and gold'20046,706,622'Bonding pad interface'20046,558,978'Chip-over-chip integrated circuit package'20036,431,432'Method for attaching solderballs by selectively oxidizing traces'20026,369,448'Vertically integrated flip chip semiconductor package'20026,294,840'Dual-thickness solder mask in integrated circuit package'20016,171,888'Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same'20016,166,434'Die clip assembly for semiconductor package'20006,008,991'Electronic system including packaged integrated circuits with heat spreading standoff support members'19996,002,171'Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package'19995,909,057'Integrated heat spreader/stiffener with apertures for semiconductor package'19995,898,575'Support assembly for mounting an integrated circuit package on a surface'19995,854,085'Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same'19985,831,836'Power plane for semiconductor device'19985,801,432'Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes'19985,780,924'Integrated circuit underfill reservoir'19985,763,952'Multi-layer tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same'19985,681,777'Process for manufacturing a multi-layer tab tape semiconductor device'19975,638,596'Method of employing multi-layer tab tape in semiconductor device assembly by selecting, breaking, downwardly bending and bonding tab tape trace free ends to a ground or power plane'19975,639,385'Method of fabricating a wafer probe card for testing an integrated circuit die'19975,552,631'Semiconductor device assembly including power or ground plane which is provided on opposite surface of insulating layer from signal traces, and is exposed to central opening in insulating layer for interconnection to semiconductor die'19965,550,406'Multi-layer tab tape having distinct signal, power and ground planes and wafer probe card with multi-layer substrate'19965,410,451'Location and standoff pins for chip on tape'1995D0341129'Remotely located controller'19933,939,699'Tensiometer with remote sensing unit'1976Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1976Based in Santa Clara, CA, US· patent location history
1993Patents assigned to AUTHORS FAMILY TRUST (1)· patent assignee history
1993Based in Perris, CA, US· patent location history
1995–2006Patents assigned to LSI LOGIC CORP (24)· patent assignee history
1995–2001Based in Redwood City, CA, US· patent location history
1999–2006Based in Palo Alto, CA, US· patent location history
2013–2019Patents assigned to AMKOR TECHNOLOGY INC (5)· patent assignee history
2013–2014Patents assigned to MCCORMICK JOHN (2)· patent assignee history
2013Patents assigned to DARVEAUX ROBERT FRANCIS (1)· patent assignee history
2013–2019Based in Chandler, AZ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LSI LOGIC CORP | 24 | 1995–2006 |
| AMKOR TECHNOLOGY INC | 5 | 2013–2019 |
| MCCORMICK JOHNself | 2 | 2013–2014 |
| AUTHORS FAMILY TRUST | 1 | 1993 |
| DARVEAUX ROBERT FRANCIS | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Redwood City, California, US | 14 | 1995–2001 |
| Palo Alto, California, US | 11 | 1999–2006 |
| Chandler, AZ, US | 5 | 2013–2019 |
| Perris, California, US | 1 | 1993 |
| Santa Clara, California, US | 1 | 1976 |