Inventor
Toshihiko Omote
Inventor
Osaka, JP
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits22%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices15%
G11BInformation storage based on relative movement between record carrier and transducer15%
Y10TTechnical subjects covered by former us classification13%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds10%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients2%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
PatentTitleYear
8,252,237'Substance detection sensor'20127,439,451'Tape carrier'20087,205,482'Tape carrier for TAB'20076,797,888'Junction flexible wiring circuit board'20046,479,615'Polyamic acid, polyimide resin obtained therefrom and application thereof to circuit board'20026,428,658'Method for manufacturing magnetic head suspensions and method for inspecting metal substrates for magnetic head suspensions'20026,399,899'Suspension board with circuit'20026,380,493'Circuit board'20026,333,139'Circuit-forming substrate and circuit substrate'20016,245,432'Circuit substrate, circuit-formed suspension substrate, and production methods therefor'20016,198,052'Circuit board with terminal accommodating level differences'20016,117,616'Circuit-forming substrate and circuit substrate'20006,100,582'Circuit substrate, circuit-formed suspension substrate, and production method thereof'20006,096,482'Circuit substrate, circuit-formed suspension substrate, and production method thereof'20005,858,518'Circuit substrate, circuit-formed suspension substrate, and production method thereof'19995,851,736'Heat-resistant photoresist composition, photosensitive substrate, and process for forming heat-resistant positive or negative pattern'19985,665,523'Heat-resistant negative photoresist composition, photosensitive substrate, and process for forming negative pattern'19975,053,314'Positively photosensitive polyimide composition'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2012Patents assigned to NITTO DENKO CORP (18)· patent assignee history
1991–2012Based in Osaka, JP· patent location history
2002–2008Based in Ibaraki, JP· patent location history
2012Patents assigned to NAITO TOSHIKI (1)· patent assignee history
2012Patents assigned to OMOTE TOSHIHIKO (1)· patent assignee history
2012Patents assigned to YAMAZAKI HIROSHI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 18 | 1991–2012 |
| NAITO TOSHIKI | 1 | 2012 |
| OMOTE TOSHIHIKOself | 1 | 2012 |
| YAMAZAKI HIROSHI | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 13 | 1991–2012 |
| Ibaraki, JP | 5 | 2002–2008 |