Inventor
Kai-Hsuan Lee
Inventor
Hsinchu, TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H01LSemiconductor devices16%
G02BOptical elements, systems or apparatus5%
G02CSpectacles5%
G06FElectric digital data processing5%
G09FDisplaying5%
H10BElectronic memory devices5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
11,067,807Smart glasses202110,985,167Flexible merge scheme for source/drain epitaxy regions202110,971,408Contact air gap formation and structures thereof202110,923,565Self-aligned contact air gap formation20217,605,444'Fuse box reducing damage caused by laser blowing and cross talk'20097,556,989'Semiconductor device having fuse pattern and methods of fabricating the same'20097,492,032'Fuse regions of a semiconductor memory device and methods of fabricating the same'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009Patents assigned to SAMSUNG ELECTRONICS CO LTD (3)· patent assignee history
2009Based in Seoul, KR· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
2021Patents assigned to CHIUN MAI COMMUNICATION SYSTEMS INC (1)· patent assignee history
2021Based in Hsinchu, TW· patent location history
2021Based in New Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 3 | 2009 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 3 | 2021 |
| CHIUN MAI COMMUNICATION SYSTEMS INC | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 3 | 2021 |
| Seoul, KR | 3 | 2009 |
| New Taipei, TW | 1 | 2021 |