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Inventor

ByoungWook Jang

Inventor
Kyonggi-do, KR

Overview

5→
Patents
2012–2016
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1071%
H01LSemiconductor devices29%
PatentTitleYear
9,252,095'Semiconductor package and method of fabricating the same'20169,252,031'Semiconductor package and method of fabricating the same'20168,785,251'Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die'20148,569,895'Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die'20138,193,036'Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2016Patents assigned to JANG BYOUNGWOOK (3)· patent assignee history
2012–2014Patents assigned to STATS CHIPPAC LTD (3)· patent assignee history
2012–2013Patents assigned to MOON DONGSOO (2)· patent assignee history
2012–2013Patents assigned to PARK SOOMOON (2)· patent assignee history
2012–2014Based in Kyonggi-do, KR· patent location history
2016Patents assigned to SAMSUNG ELECTRONICS CO LTD (2)· patent assignee history
2016Based in Hwaseong-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
JANG BYOUNGWOOKself32012–2016
STATS CHIPPAC LTD32012–2014
MOON DONGSOO22012–2013
PARK SOOMOON22012–2013
SAMSUNG ELECTRONICS CO LTD22016
Locations
LocationPatentsSpan
Kyonggi-do, KR32012–2014
Hwaseong-si, KR22016