Inventor
YING-HAO WEI
Inventor
TW
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,009,313Semiconductor package shielding structure2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024Patents assigned to ADVANCED SEMICONDUCTOR ENG (1)· patent assignee history
2024Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 1 | 2024 |