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Inventor

Ryo Oishi

Inventor
Saitama, JP

Overview

18→
Patents
2001–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 18 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
C22CAlloys17%
H01LSemiconductor devices17%
B23KSoldering or unsoldering14%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form10%
Y10TTechnical subjects covered by former us classification7%
C23CCoating metallic material6%
C22FChanging the physical structure of non-ferrous metals and non-ferrous alloys4%
B21CManufacture of metal sheets, wire, rods, tubes, profiles or like semi-manufactured products otherwise than by rolling3%
H10HInorganic light-emitting semiconductor devices having potential barriers3%
PatentTitleYear
10,737,356Bonding wire for semiconductor device202010,610,976Bonding wire for semiconductor device202010,525,555Bonding wire for semiconductor device202010,468,370Bonding wire for semiconductor device201910,414,002Bonding wire for semiconductor device201910,137,534Bonding wire for semiconductor device201810,121,758Bonding wire for semiconductor device201810,121,764Method for forming ball in bonding wire201810,032,741Bonding wire for semiconductor device20189,887,172'Bonding wire for semiconductor device'20189,773,748'Bonding wire for semiconductor device'20179,543,266'Bonding wire for semiconductor device use and method of production of same'20179,536,854'Bonding wire for semiconductor device use and method of production of same'2017D0743918'Light emitting diode'20158,815,019'Bonding wire for semiconductor'2014D0661262'Light emitting diode'20126,488,888'Lead-free solder alloys'20026,241,942'Lead-free solder alloys'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2002Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (2)· patent assignee history
2001–2002Based in Tokyo, JP· patent location history
2012–2015Patents assigned to NICHIA CORP (2)· patent assignee history
2012–2015Based in Hamamatsu, JP· patent location history
2014–2020Patents assigned to NIPPON MICROMETAL CORP (13)· patent assignee history
2014Based in Iruma, JP· patent location history
2017–2019Patents assigned to NIPPON STEEL & SUMIKIN MAT CO (9)· patent assignee history
2017–2020Based in Saitama, JP· patent location history
2019–2020Patents assigned to NIPPON STEEL CHEMICAL & MAT CO LTD (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NIPPON MICROMETAL CORP132014–2020
NIPPON STEEL & SUMIKIN MAT CO92017–2019
NIPPON STEEL CHEMICAL & MAT CO LTD42019–2020
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD22001–2002
NICHIA CORP22012–2015
Locations
LocationPatentsSpan
Saitama, JP132017–2020
Hamamatsu, JP22012–2015
Tokyo, JP22001–2002
Iruma, JP12014