LexDanaLexDanabeta
Inventor

Hui Wang

Inventor
Wildwood, MO, US

Overview

2→
Patents
2021
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
C09GPolishing compositions17%
Y02PClimate change mitigation technologies in the production or processing of goods17%
PatentTitleYear
11,043,395Methods for processing semiconductor wafers having a polycrystalline finish202111,037,804Methods and apparatus for cleaning substrates2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021Patents assigned to ACM RES INC (1)· patent assignee history
2021Patents assigned to ACM RESEARCH SHANGHAI INC (1)· patent assignee history
2021Patents assigned to GLOBALWAFERS CO LTD (1)· patent assignee history
2021Patents assigned to SUNEDISON SEMICONDUCTOR LTD UEN201334164H (1)· patent assignee history
2021Based in Wildwood, MO, US· patent location history
2021Based in Fremont, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ACM RES INC12021
ACM RESEARCH SHANGHAI INC12021
GLOBALWAFERS CO LTD12021
SUNEDISON SEMICONDUCTOR LTD UEN201334164H12021
Locations
LocationPatentsSpan
Wildwood, MO, US12021
Fremont, California, US12021