Inventor
Stephen G. Starr
Inventor
Essex Junction, VT, US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1053%
Y10TTechnical subjects covered by former us classification20%
B23KSoldering or unsoldering7%
C23CCoating metallic material7%
H01RElectrically-conductive connections7%
H05KPrinted circuits7%
PatentTitleYear
6,002,164'Semiconductor lead frame'19995,776,790'C4 Pb/Sn evaporation process'19985,576,246'Personalized area leadframe coining or half etching for reduced mechanical stress at device edge'19965,545,921'Personalized area leadframe coining or half etching for reduced mechanical stress at device edge'19965,151,559'Planarized thin film surface covered wire bonded semiconductor package'19925,086,018'Method of making a planarized thin film covered wire bonded semiconductor package'19924,965,654'Semiconductor package with ground plane'19904,907,734'Method of bonding gold or gold alloy wire to lead tin solder'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–1999Patents assigned to IBM (8)· patent assignee history
1990–1999Based in Essex Junction, VT, US· patent location history
1996Patents assigned to SIEMENS AG (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 8 | 1990–1999 |
| SIEMENS AG | 2 | 1996 |
Locations
| Location | Patents | Span |
|---|---|---|
| Essex Junction, VT, US | 8 | 1990–1999 |