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Inventor

Christopher J. Healy

Inventor
San Diego, CA, US

Overview

6→
Patents
2013–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 6 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%
H01LSemiconductor devices23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
H05KPrinted circuits8%
Y10TTechnical subjects covered by former us classification8%
PatentTitleYear
10,410,971Thermal and electromagnetic interference shielding for die embedded in package substrate201910,002,857Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer20189,313,881'Through mold via relief gutter on molded laser package (MLP) packages'20168,753,926'Electronic packaging with a variable thickness mold cap'20148,546,921'Hybrid multilayer substrate'20138,371,497'Method for manufacturing tight pitch, flip chip integrated circuit packages'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2019Patents assigned to QUALCOMM INC (6)· patent assignee history
2013–2014Patents assigned to HEALY CHRISTOPHER J (2)· patent assignee history
2013–2014Patents assigned to JHA GOPAL C (2)· patent assignee history
2013–2014Patents assigned to RAMADOSS VIVEK (2)· patent assignee history
2013Patents assigned to HEALY CHRISTOPHER JAMES (1)· patent assignee history
2013–2019Based in San Diego, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
QUALCOMM INC62013–2019
HEALY CHRISTOPHER Jself22013–2014
JHA GOPAL C22013–2014
RAMADOSS VIVEK22013–2014
HEALY CHRISTOPHER JAMESself12013
Locations
LocationPatentsSpan
San Diego, California, US62013–2019