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Inventor

Yunlong Sun

Inventor
Beaverton, OR, US

Overview

47→
Patents
1993–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 47 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering29%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
H05KPrinted circuits5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
B28DWorking stone or stone-like materials2%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein2%
H10DInorganic electric semiconductor devices2%
PatentTitleYear
11,125,939Waveguide filtering biochemical sensor202111,115,999Information transmission method, base station, and user equipment202110,896,188Method and apparatus for determining search results, device and computer storage medium202110,307,862Laser micromachining with tailored bursts of short laser pulses20198,710,402'Method of and apparatus for laser drilling holes with improved taper'20148,599,890'Systems and methods for laser pulse equalization'20138,526,473'Methods and systems for dynamically generating tailored laser pulses'20138,338,746'Method for processing a memory link with a set of at least two laser pulses'2012RE043605'Laser segmented cutting, multi-step cutting, or both'2012RE043487'Laser segmented cutting'2012RE043400'Laser segmented cutting, multi-step cutting, or both'20128,116,341'Multiple laser wavelength and pulse width process drilling'20127,982,161'Method and apparatus for laser drilling holes with tailored laser pulses'20117,741,131'Laser processing of light reflective multilayer target structure'20107,671,295'Processing a memory link with a set of at least two laser pulses'20107,633,034'Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure'20097,482,551'Processing a memory link with a set of at least two laser pulses'20097,420,995'Simultaneously mode-locked, Q-switched laser'20087,396,706'Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks'20087,348,516'Methods of and laser systems for link processing using laser pulses with specially tailored power profiles'20087,301,981'Methods for synchronized pulse shape tailoring'20077,289,549'Lasers for synchronized pulse shape tailoring'20077,241,669'Method of forming a scribe line on a passive electronic component substrate'20077,139,294'Multi-output harmonic laser and methods employing same'20067,126,746'Generating sets of tailored laser pulses'2006RE039001'Laser cutting method for forming magnetic recording head sliders'20066,949,449'Method of forming a scribe line on a ceramic substrate'20056,947,454'Laser pulse picking employing controlled AOM loading'20056,919,532'Method of forming dimensionally precise slots in resilient mask of miniature component carrier'20056,887,804'Passivation processing over a memory link'20056,806,440'Quasi-CW diode pumped, solid-state UV laser system and method employing same'20046,781,090'Quasi-CW diode-pumped, solid-state harmonic laser system and method employing same'20046,676,878'Laser segmented cutting'20046,664,174'Semiconductor device and method for fabricating the same'20036,574,250'Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths'20036,534,743'Resistor trimming with small uniform spot from solid-state UV laser'20036,297,541'Semiconductor device and method for fabricating the same'20016,057,180'Method of severing electrically conductive links with ultraviolet laser output'20006,025,256'Laser based method and system for integrated circuit repair or reconfiguration'20005,808,272'Laser system for functional trimming of films and devices'19985,685,995'Method for laser functional trimming of films and devices'19975,590,141'Method and apparatus for generating and employing a high density of excited ions in a lasant'19965,569,398'Laser system and method for selectively trimming films'19965,473,624'Laser system and method for selectively severing links'19955,361,268'Switchable two-wavelength frequency-converting laser system and power control therefor'19945,323,414'Laser system and method employing a nonimaging concentrator'19945,265,114'System and method for selectively laser processing a target structure of one or more materials of a multimaterial, multilayer device'1993

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993–2019Patents assigned to ELECTRO SCIENT IND INC (42)· patent assignee history
1993–2003Based in Portland, OR, US· patent location history
1994–2000Based in Aloha, OR, US· patent location history
2003–2019Based in Beaverton, OR, US· patent location history
2012–2019Patents assigned to SUN YUNLONG (9)· patent assignee history
2012–2013Patents assigned to BAIRD BRIAN W (4)· patent assignee history
2012Patents assigned to HARRIS RICHARD S (4)· patent assignee history
2012Patents assigned to FAHEY KEVIN P (3)· patent assignee history
2021Based in Shanghai, CN· patent location history
2021Based in Shenzhen, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ELECTRO SCIENT IND INC421993–2019
SUN YUNLONGself92012–2019
BAIRD BRIAN W42012–2013
HARRIS RICHARD S42012
FAHEY KEVIN P32012
Locations
LocationPatentsSpan
Beaverton, OR, US322003–2019
Portland, OR, US91993–2003
Aloha, OR, US31994–2000
Shanghai, CN12021
Shenzhen, CN12021