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Inventor

DokOk Yu

Inventor
Seoul, KR

Overview

2→
Patents
2013–2015
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H01LSemiconductor devices25%
Y10TTechnical subjects covered by former us classification25%
PatentTitleYear
9,142,481'Integrated circuit packaging system with heatsink cap and method of manufacture thereof'20158,524,538'Integrated circuit packaging system with film assistance mold and method of manufacture thereof'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2015Patents assigned to STATS CHIPPAC LTD (2)· patent assignee history
2013–2015Patents assigned to YU DOKOK (2)· patent assignee history
2013Patents assigned to JANG KI YOUN (1)· patent assignee history
2013–2015Based in Seoul, KR· patent location history
2015Patents assigned to CHUNG JAE HAN (1)· patent assignee history
2015Patents assigned to JUNG HOON (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
STATS CHIPPAC LTD22013–2015
YU DOKOKself22013–2015
CHUNG JAE HAN12015
JANG KI YOUN12013
JUNG HOON12015
Locations
LocationPatentsSpan
Seoul, KR22013–2015