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Inventor

Masakazu Hamada

Inventor
Toyama, JP

Overview

4→
Patents
1992–2017
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
B24BMachines, devices, or processes for grinding or polishing11%
C25DProcesses for the electrolytic or electrophoretic production of coatings11%
H01LSemiconductor devices11%
H05KPrinted circuits11%
H10DInorganic electric semiconductor devices11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
PatentTitleYear
9,673,139'Semiconductor device'20177,564,133'Semiconductor device and method for fabricating the same'20096,100,112'Method of manufacturing a tape carrier with bump'20005,083,401'Method of polishing'1992

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1992Patents assigned to MITSUBISHI ELECTRIC CORP (1)· patent assignee history
1992Based in Kanagawa, JP· patent location history
2000Patents assigned to FURUKAWA ELECTRIC CO LTD (1)· patent assignee history
2000Based in Fujisawa, JP· patent location history
2009Patents assigned to PANASONIC CORP (1)· patent assignee history
2009Patents assigned to RENESAS TECH CORP (1)· patent assignee history
2009Based in Osaka, JP· patent location history
2017Patents assigned to PANASONIC IP MAN CO LTD (1)· patent assignee history
2017Based in Toyama, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FURUKAWA ELECTRIC CO LTD12000
MITSUBISHI ELECTRIC CORP11992
PANASONIC CORP12009
PANASONIC IP MAN CO LTD12017
RENESAS TECH CORP12009
Locations
LocationPatentsSpan
Toyama, JP12017
Osaka, JP12009
Fujisawa, JP12000
Kanagawa, JP11992