Inventor
Chi Hoon Lee
Inventor
Suwon-si, KR
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
G06FElectric digital data processing13%
H10DInorganic electric semiconductor devices13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H10BElectronic memory devices10%
H01LSemiconductor devices8%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
A41DOuterwear2%
A61FFilters implantable into blood vessels2%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
PatentTitleYear
11,121,141Semiconductor structure and method for forming the same202111,101,354Method for forming semiconductor device structure with metal silicide layer202111,000,082Assistive glove for artificial hands202110,852,259Apparatus for X-ray inspection, and a method for manufacturing a semiconductor device using the same202010,613,724Control method for selecting and pasting content202010,210,243Method and system for enhanced query term suggestion20199,767,183'Method and system for enhanced query term suggestion'2017RE046549'Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption film'20178,463,737'Realtime unification management information data conversion and monitoring apparatus and method for thereof'20138,255,414'Search assist powered by session analysis'20128,135,997'Method for obstruction and capacity information unification monitoring in unification management system environment and system for thereof'20127,916,237'Liquid crystal display device'20116,835,998'Fuse area structure including protection film on sidewall of fuse opening in semiconductor device and method of forming the same'20046,696,353'Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption film'20046,566,735'Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption film'20036,509,255'Fuse area structure having guard ring surrounding fuse opening in semiconductor device and method of forming the same'20036,507,086'Fuse area structure having guard ring surrounding fuse opening in semiconductor device and method of forming the same'20036,448,113'Method of forming fuse area structure including protection film on sidewall of fuse opening in semiconductor device'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (8)· patent assignee history
2002–2013Based in Suwon-si, KR· patent location history
2012–2013Patents assigned to KANG CHEOL JU (2)· patent assignee history
2012–2013Patents assigned to KIM BYUNG SEOP (2)· patent assignee history
2012–2013Patents assigned to LEE CHI HOON (2)· patent assignee history
2017–2019Patents assigned to EXCALIBUR IP LLC (2)· patent assignee history
2017–2019Based in Santa Clara, CA, US· patent location history
2020Based in Seoul, KR· patent location history
2021Based in Tainan, TW· patent location history
2021Based in West Lafayette, IN, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 8 | 2002–2020 |
| EXCALIBUR IP LLC | 2 | 2017–2019 |
| KANG CHEOL JU | 2 | 2012–2013 |
| KIM BYUNG SEOP | 2 | 2012–2013 |
| LEE CHI HOONself | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Suwon-si, KR | 9 | 2002–2013 |
| Tainan, TW | 2 | 2021 |
| Seoul, KR | 2 | 2020 |
| Santa Clara, California, US | 2 | 2017–2019 |
| West Lafayette, IN, US | 1 | 2021 |