Inventor
NAZILA DADVAND
Inventor
US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
C25DProcesses for the electrolytic or electrophoretic production of coatings7%
C23CCoating metallic material5%
B82YSpecific uses or applications of nanostructures3%
C01BNon-metallic elements3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds2%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds2%
PatentTitleYear
12,476,173Electronic device with post mold plated nickel tungsten and tin bilayer for improved board level reliability202512,312,703Neutral pH copper plating solution for undercut reduction202512,237,219Contact with bronze material to mitigate undercut202512,180,595Chemically anchored mold compounds in semiconductor packages202412,154,845Semiconductor package with nickel-silver pre-plated leadframe202412,139,569Filler particles for polymers202412,074,096Die attach surface copper layer with protective layer for microelectronic devices202412,068,221Plating for thermal management202411,984,418Method of forming brass-coated metals in flip-chip redistribution layers202411,938,715None202411,935,821Quad flat no-lead package with wettable flanges202411,908,776Semiconductor device with metal die attach to substrate with multi-size cavity202411,854,933Thermally conductive wafer layer202311,848,258Semiconductor package with nickel-silver pre-plated leadframe202311,694,947Multi-pitch leads202311,594,504Nickel alloy for semiconductor packaging202311,587,858Zinc-cobalt barrier for interface in solder bond applications202311,443,996Zinc layer for a semiconductor die pillar202211,410,947Brass-coated metals in flip-chip redistribution layers202211,390,527Multi-layered SP202211,370,662Hexagonal boron nitride structures202211,355,414Nanoparticle matrix for backside heat spreading202211,309,388Multi-super lattice for switchable arrays202211,282,770Leadless packaged device with metal die attach202211,254,775Filler particles for polymers202211,145,598Lattice bump interconnect2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TEXAS INSTRUMENTS INC (26)· patent assignee history
2021–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 26 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 26 | 2021–2025 |