Inventor
Maju TOMURA
Inventor
JP
Overview
Patents· 38 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
H01JElectric discharge tubes or discharge lamps28%
H01LSemiconductor devices27%
C23CCoating metallic material7%
H05HPlasma technique3%
H10BElectronic memory devices2%
H10DInorganic electric semiconductor devices2%
B05DProcesses for applying fluent materials to surfaces, in general1%
B08BCleaning in general1%
C09KMaterials for miscellaneous applications, not provided for elsewhere1%
PatentTitleYear
12,568,782Etching method and plasma processing system202612,560,863Etching method and plasma processing system202612,537,171Substrate processing method and substrate processing apparatus202612,532,681Etching method and plasma processing system202612,512,325Etching method and etching apparatus202512,412,749Etching method and plasma processing system202512,400,835Plasma processing method and plasma processing system202512,387,936Plasma processing method and plasma processing system202512,387,941Etching method and plasma processing apparatus202512,368,027Substrate processing method and substrate processing apparatus202512,341,020Substrate processing method and substrate processing apparatus202512,198,938Etching method202512,142,484Etching method202412,112,954Etching method, substrate processing apparatus, and substrate processing system202412,062,522Plasma etching method and plasma etching apparatus202412,051,570Plasma processing apparatus202411,996,296Substrate processing method and substrate processing system202411,961,746Substrate processing method and substrate processing apparatus202411,810,791Etching method, substrate processing apparatus, and substrate processing system202311,798,793Substrate processing method, component processing method, and substrate processing apparatus202311,728,166Substrate processing method and substrate processing apparatus202311,637,003Method for etching film and plasma processing apparatus202311,615,964Etching method202311,600,501Etching method and plasma processing apparatus202311,551,937Etching method202311,495,468Etching method and etching apparatus202211,482,425Etching method and etching apparatus202211,456,180Etching method202211,450,537Substrate processing method and substrate processing apparatus202211,417,535Etching method and plasma processing apparatus202211,380,555Etching method and etching apparatus202211,361,976Substrate processing method and plasma processing apparatus202211,355,352Plasma etching method and plasma etching apparatus202211,355,350Etching method, substrate processing apparatus, and substrate processing system202211,342,194Substrate processing method and substrate processing apparatus202211,270,889Etching method and etching apparatus202211,171,012Method and apparatus for formation of protective sidewall layer for bow reduction202111,139,169Etching method and etching apparatus2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TOKYO ELECTRON LTD (38)· patent assignee history
2021–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO ELECTRON LTD | 38 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 38 | 2021–2026 |