Inventor
Ching-Wei Hsueh
Inventor
Tainan, TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G05Fprimary
G05FSystems for regulating electric or magnetic variables20%
H05BElectric heating20%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications20%
H02HEmergency protective circuit arrangements13%
H02JElectric power networks7%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems7%
H03FAmplifiers7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
PatentTitleYear
8,907,630'Inrush current protection circuit'20148,704,501'Driver, current regulating circuit thereof, and method of current regulation, with alternating voltages therein'20148,384,655'LED driving circuit and method of controlling the same'20138,194,377'Driver and over-current protection circuit therein'20128,004,201'LED circuit'20117,825,729'Class AB rail-to-rail operational amplifier'20107,495,503'Current biasing circuit'20097,002,332'Source and sink voltage regulator'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006Patents assigned to WINBOND ELECTRONICS CORP (1)· patent assignee history
2006Based in Taipei, TW· patent location history
2009–2014Patents assigned to HIMAX ANALOGIC INC (7)· patent assignee history
2009–2014Based in Tainan, TW· patent location history
2012–2014Patents assigned to HSUEH CHING-WEI (4)· patent assignee history
2012–2014Patents assigned to TSENG KUAN-JEN (3)· patent assignee history
2014Based in Taina, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HIMAX ANALOGIC INC | 7 | 2009–2014 |
| HSUEH CHING-WEIself | 4 | 2012–2014 |
| TSENG KUAN-JEN | 3 | 2012–2014 |
| WINBOND ELECTRONICS CORP | 1 | 2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tainan, TW | 6 | 2009–2014 |
| Taina, TW | 1 | 2014 |
| Taipei, TW | 1 | 2006 |